{
  "schema": "semiagora.bonding-integration-source-spine.v1",
  "version": "2026-08-30-bonding-integration-v1",
  "experimentId": "SA-PKG-BOND-037",
  "generatedAt": "2026-08-30T00:00:00+09:00",
  "sourceBodiesStored": false,
  "sourceNumericUse": "none",
  "rightsMode": "link-only",
  "sourceCount": 20,
  "claimNodeCount": 16,
  "inputHashesSha256": {
    "bonding-integration-state-contract-v1.json": "EF2170E5E3A035A4BE9E8800644D39562FEF2252C872C2478E202F0B828EC4B6",
    "bonding-integration-metric-contract-v1.json": "3A008BC4A70E053CB2DF6B99B7C306EBF9358DC9D4C99FD267FFBAA6FF3FC67C",
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    "independent-verifier-contract-v1.json": "FD68F60B339D76A796466B7C9DE59F05D2DCB8C30BC5F00D53E439163E6F0143"
  },
  "sources": [
    {
      "id": "semi-3d2-glass-carrier",
      "label": "SEMI 3D2 - Glass Carrier Wafers for 3DS-IC Applications",
      "publisher": "SEMI",
      "url": "https://store-us.semi.org/products/3d00200-semi-3d2-specification-for-glass-carrier-wafers-for-3ds-ic-applications",
      "sourceType": "official-standard-page-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for temporary-bond carrier-wafer scope and applicability.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "semi-3d4-bonded-stack-geometry",
      "label": "SEMI 3D4 - Metrology for Bonded Wafer Stack Thickness, TTV, Bow, Warp, Sori, and Flatness",
      "publisher": "SEMI",
      "url": "https://store-us.semi.org/products/3d00400-semi-3d4-guide-for-metrology-for-measuring-thickness-total-thickness-variation-ttv-bow-warp-sori-and-flatness-of-bonded-wafer-stacks",
      "sourceType": "official-standard-page-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for bonded-stack geometry and metrology categories.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "semi-3d7-alignment-mark",
      "label": "SEMI 3D7 - Alignment Mark for 3DS-IC Process",
      "publisher": "SEMI",
      "url": "https://store-us.semi.org/products/3d00700-semi-3d7-guide-for-alignment-mark-for-3ds-ic-process",
      "sourceType": "official-standard-page-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for chip-to-chip, chip-to-wafer, and wafer-to-wafer alignment-mark categories.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "semi-3d13-bond-void-metrology",
      "label": "SEMI 3D13 - Measuring Voids in Bonded Wafer Stacks",
      "publisher": "SEMI",
      "url": "https://store-us.semi.org/products/3d01300-semi-3d13-guide-for-measuring-voids-in-bonded-wafer-stacks",
      "sourceType": "official-standard-page-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for bonded-interface void metrology categories.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "semi-3d14-3ds-quality-flow",
      "label": "SEMI 3D14 - Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products",
      "publisher": "SEMI",
      "url": "https://store-us.semi.org/products/3d01400-semi-3d14-guide-for-incoming-outgoing-quality-control-and-testing-flow-for-3ds-ic-products",
      "sourceType": "official-standard-page-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for quality-control, test-flow, and evidence-ownership categories.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "semi-ms5-bond-strength",
      "label": "SEMI MS5 - Wafer Bond Strength Measurement Using Micro-Chevron Test Structures",
      "publisher": "SEMI",
      "url": "https://store-us.semi.org/products/ms00500-semi-ms5-test-method-for-wafer-bond-strength-measurements-using-micro-chevron-test-structures",
      "sourceType": "official-standard-page-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for wafer-bond strength test and mechanical-evidence categories.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "plossl-direct-bonding-1999",
      "label": "Wafer direct bonding: tailoring adhesion between brittle materials",
      "publisher": "Elsevier BV",
      "url": "https://doi.org/10.1016/S0927-796X(98)00017-5",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for direct-bond adhesion and brittle-material interface framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "spierings-surface-bonding-1995",
      "label": "Surface-related phenomena in the direct bonding of silicon and fused-silica wafer pairs",
      "publisher": "Elsevier BV",
      "url": "https://doi.org/10.1016/0165-5817(95)82003-5",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for surface-state phenomena in direct wafer bonding.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "kissinger-void-free-strengthening-1993",
      "label": "Void-free silicon-wafer-bond strengthening in the 200–400 °C range",
      "publisher": "Elsevier BV",
      "url": "https://doi.org/10.1016/0924-4247(93)85009-5",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for void-free bond strengthening and low-temperature process framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "made-cu-thermocompression-2012",
      "label": "Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits",
      "publisher": "Elsevier BV",
      "url": "https://doi.org/10.1016/j.actamat.2011.09.038",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for Cu-Cu thermo-compression mechanical-property evidence framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "hu-low-temperature-cu-hybrid-2021",
      "label": "Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)",
      "publisher": "Elsevier BV",
      "url": "https://doi.org/10.1016/j.microrel.2021.114412",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for low-temperature Cu-Cu and hybrid-bond development framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "made-current-stressing-cu-interface-2013",
      "label": "Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits",
      "publisher": "Elsevier BV",
      "url": "https://doi.org/10.1016/j.mee.2013.01.020",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for electrical stressing and Cu-Cu interface-imperfection framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "chidambaram-fusion-hybrid-quality-2019",
      "label": "Wafer Level Fusion and Hybrid Bonding: Impact of Critical Process Parameters on Bond Quality",
      "publisher": "IEEE",
      "url": "https://doi.org/10.1109/EPTC47984.2019.9026700",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for fusion and hybrid bond quality versus critical-process-category framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "shi-chip-to-wafer-hybrid-2024",
      "label": "3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-to-Wafer Hybrid Bonding",
      "publisher": "IEEE",
      "url": "https://doi.org/10.1109/ECTC51529.2024.00017",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for fine-pitch chip-to-wafer hybrid-bond integration framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "oprins-hybrid-thermal-resistance-2020",
      "label": "3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding",
      "publisher": "IEEE",
      "url": "https://doi.org/10.1109/ITherm45881.2020.9190392",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for bond-interface thermal-resistance comparison framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "mo-temporary-bond-debond-2023",
      "label": "Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications",
      "publisher": "MDPI AG",
      "url": "https://doi.org/10.3390/electronics12071666",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for temporary bonding and debonding review framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "montmeat-temporary-polymer-2021",
      "label": "Temporary polymer bonding for the manufacturing of thin wafers: An innovative low temperature process",
      "publisher": "Elsevier BV",
      "url": "https://doi.org/10.1016/j.mssp.2020.105550",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for temporary polymer bonding for thin-wafer manufacturing framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "liu-temporary-wafer-materials-2017",
      "label": "Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing",
      "publisher": "IMAPS - International Microelectronics Assembly and Packaging Society",
      "url": "https://doi.org/10.4071/imaps.349121",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for temporary bonding materials and mechanical or laser debond framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "onishi-temporary-direct-bond-2024",
      "label": "Temporary Direct Bonding by Low Temperature Deposited SiO<sub>2</sub> for Chiplet Applications",
      "publisher": "American Chemical Society (ACS)",
      "url": "https://doi.org/10.1021/acsaelm.4c00114",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for temporary direct bonding for chiplet application framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    },
    {
      "id": "faure-ultra-low-temp-hybrid-2024",
      "label": "Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations",
      "publisher": "IEEE",
      "url": "https://doi.org/10.1109/ESTC60143.2024.10712151",
      "sourceType": "peer-reviewed-publication-record",
      "rightsStatus": "link-only",
      "numericUse": "none",
      "use": "Category-level provenance for ultra-low-temperature hybrid-bond morphology and electrical characterization framing.",
      "artifactUse": "Link-only metadata and category-level provenance. No source body, abstract wording, numeric value, equation, coefficient, geometry, recipe, specification limit, method setting, figure, table, code, image, result, or production decision enters generated artifacts."
    }
  ],
  "claims": [
    {
      "node_id": "BI-C01",
      "claim": "Bonding-integration review separates family, alignment, surface and interface, force-temperature, void and warpage, electrical and reliability, quality-flow, and disposition categories.",
      "source_ids": [
        "semi-3d7-alignment-mark",
        "semi-3d13-bond-void-metrology",
        "semi-3d14-3ds-quality-flow",
        "semi-ms5-bond-strength"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C02",
      "claim": "Fusion, hybrid, thermo-compression, and temporary bonding require family-specific applicability evidence rather than generic substitution.",
      "source_ids": [
        "plossl-direct-bonding-1999",
        "made-cu-thermocompression-2012",
        "mo-temporary-bond-debond-2023",
        "chidambaram-fusion-hybrid-quality-2019"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C03",
      "claim": "Alignment-mark, registration, placement, and overlay evidence must remain distinct from correction commands and acceptance decisions.",
      "source_ids": [
        "semi-3d7-alignment-mark",
        "chidambaram-fusion-hybrid-quality-2019",
        "shi-chip-to-wafer-hybrid-2024"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C04",
      "claim": "Surface state, activation, contamination, and interface formation are separate evidence categories and cannot be collapsed into a single readiness value.",
      "source_ids": [
        "spierings-surface-bonding-1995",
        "kissinger-void-free-strengthening-1993",
        "chidambaram-fusion-hybrid-quality-2019"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C05",
      "claim": "Force-temperature-window evidence is separated from recipe settings, equipment commands, and transferable process recommendations.",
      "source_ids": [
        "made-cu-thermocompression-2012",
        "hu-low-temperature-cu-hybrid-2021",
        "faure-ultra-low-temp-hybrid-2024"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C06",
      "claim": "Bonded-stack geometry, void occurrence, and interface-gap evidence require distinct measurement ownership and map traceability.",
      "source_ids": [
        "semi-3d4-bonded-stack-geometry",
        "semi-3d13-bond-void-metrology",
        "kissinger-void-free-strengthening-1993"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C07",
      "claim": "Electrical interface behavior, current-stress evidence, thermal resistance, and reliability evidence remain separate from production disposition.",
      "source_ids": [
        "made-current-stressing-cu-interface-2013",
        "oprins-hybrid-thermal-resistance-2020",
        "faure-ultra-low-temp-hybrid-2024"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C08",
      "claim": "Temporary bonding requires explicit carrier, support, release, and debond evidence boundaries before any thinning or dicing handoff.",
      "source_ids": [
        "semi-3d2-glass-carrier",
        "mo-temporary-bond-debond-2023",
        "montmeat-temporary-polymer-2021",
        "liu-temporary-wafer-materials-2017",
        "onishi-temporary-direct-bond-2024"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C09",
      "claim": "Fusion and hybrid bond quality review separates alignment, surface, thermal-mechanical, void, and electrical evidence categories.",
      "source_ids": [
        "chidambaram-fusion-hybrid-quality-2019",
        "shi-chip-to-wafer-hybrid-2024",
        "hu-low-temperature-cu-hybrid-2021"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C10",
      "claim": "Bond strength, adhesion, fracture, and mechanical-property evidence are test-owned categories and are not inferred from teaching proxies.",
      "source_ids": [
        "semi-ms5-bond-strength",
        "plossl-direct-bonding-1999",
        "made-cu-thermocompression-2012"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C11",
      "claim": "Thermal-resistance evidence is an owned interface result and is not inferred from categorical bond-family or force-temperature states.",
      "source_ids": [
        "oprins-hybrid-thermal-resistance-2020",
        "made-cu-thermocompression-2012",
        "hu-low-temperature-cu-hybrid-2021"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C12",
      "claim": "Incoming and outgoing quality flow, test ownership, qualification, release, hold, and escalation must remain accountable replacement-evidence records.",
      "source_ids": [
        "semi-3d14-3ds-quality-flow",
        "semi-ms5-bond-strength",
        "made-current-stressing-cu-interface-2013"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C13",
      "claim": "Upstream substrate, surface, CMP, inspection, and equipment records may enter only through enumerated categorical bridge fields.",
      "source_ids": [
        "semi-3d4-bonded-stack-geometry",
        "semi-3d7-alignment-mark",
        "semi-3d13-bond-void-metrology"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C14",
      "claim": "Downstream thinning and dicing receive only bounded categorical readiness, priority, model-limit, and evidence-gate fields.",
      "source_ids": [
        "semi-3d2-glass-carrier",
        "mo-temporary-bond-debond-2023",
        "montmeat-temporary-polymer-2021"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C15",
      "claim": "Source records provide link-only bibliographic and category provenance; source numbers, formulas, figures, tables, recipes, and standard bodies are excluded.",
      "source_ids": [
        "semi-3d14-3ds-quality-flow",
        "plossl-direct-bonding-1999",
        "onishi-temporary-direct-bond-2024"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    },
    {
      "node_id": "BI-C16",
      "claim": "The packet is an original deterministic dimensionless teaching model requiring owned metrology, integration, reliability, and disposition evidence for real decisions.",
      "source_ids": [
        "semi-3d2-glass-carrier",
        "semi-3d4-bonded-stack-geometry",
        "semi-3d7-alignment-mark",
        "semi-3d13-bond-void-metrology",
        "semi-3d14-3ds-quality-flow",
        "semi-ms5-bond-strength",
        "plossl-direct-bonding-1999",
        "spierings-surface-bonding-1995",
        "kissinger-void-free-strengthening-1993",
        "made-cu-thermocompression-2012",
        "hu-low-temperature-cu-hybrid-2021",
        "made-current-stressing-cu-interface-2013",
        "chidambaram-fusion-hybrid-quality-2019",
        "shi-chip-to-wafer-hybrid-2024",
        "oprins-hybrid-thermal-resistance-2020",
        "mo-temporary-bond-debond-2023",
        "montmeat-temporary-polymer-2021",
        "liu-temporary-wafer-materials-2017",
        "onishi-temporary-direct-bond-2024",
        "faure-ultra-low-temp-hybrid-2024"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, equation, coefficient, geometry, condition, recipe, specification limit, method setting, result, figure, table, code, image, automatic action, or production disposition is imported."
    }
  ],
  "hardBoundary": "No source body, abstract wording, numeric value, equation, coefficient, material value, geometry, physical condition, method detail, result, figure, table, code, image, named-tool output, proprietary output, standard body, specification limit, recipe, alignment setting, surface-preparation setting, force-temperature setting, void map, reliability result, acceptance criterion, equipment action, disposition, or live run enters generation."
}