{ "schema": "semiagora.bonding-integration-public-manifest.v1", "version": "2026-08-30-bonding-integration-packet-v1", "packetVersion": "2026-08-30-bonding-integration-v1", "experimentId": "SA-PKG-BOND-037", "generatedAt": "2026-08-30T00:00:00+09:00", "status": "packet-only-not-deployed", "counts": { "rows": 6912, "physicalRows": 3456, "evidencePairs": 3456, "evidencePairComparisons": 656640, "columns": 192, "sources": 20, "claimNodes": 16, "normalizedProxyEquations": 20, "exactIntegerLedgerEquations": 16, "exactIntegerLedgers": 3, "prohibitedZeroFields": 112 }, "axes": [ { "id": "bonding_family", "count": 4, "values": [ "fusion-bond-like", "hybrid-bond-like", "thermo-compression-bond-like", "temporary-bond-like" ], "meaning": "Categorical bonding family only; not a supplier, material stack, tool, geometry, recipe, qualification, or production route." }, { "id": "alignment_state", "count": 3, "values": [ "alignment-constrained-like", "alignment-uncertainty-exposed-like", 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"void-warpage-constrained-like", "void-warpage-supported-like" ], "meaning": "Categorical bonded-interface void and assembled-stack warpage evidence posture only; not a void map, thickness, bow, warp, flatness, geometry result, specification, or disposition." }, { "id": "electrical_reliability_state", "count": 2, "values": [ "electrical-reliability-supported-like", "electrical-reliability-constrained-like" ], "meaning": "Categorical interface resistance, bond strength, thermal, electrical, and reliability evidence posture only; not a measured value, stress condition, lifetime, acceptance, release, or hold." }, { "id": "ordered_bond_state", "count": 8, "values": [ "bond-state-a", "bond-state-b", "bond-state-c", "bond-state-d", "bond-state-e", "bond-state-f", "bond-state-g", "bond-state-h" ], "meaning": "Deterministic teaching sweep index only; it is not time, process order, wafer position, die number, tool history, bond cycle, or production state." }, { "id": "evidence_posture", 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No alignment setting, surface-preparation instruction, force-temperature recipe, void or warpage limit, resistance or reliability result, acceptance criterion, sampling plan, equipment action, qualification, disposition, thinning or dicing readiness, or production fitness is computed or implied." }