{ "schema": "semiagora.cmp-public-manifest.v1", "version": "2026-08-30-cmp-packet-v1", "packetVersion": "2026-08-30-cmp-v1", "experimentId": "SA-PROC-CMP-028", "generatedAt": "2026-08-30T00:00:00+09:00", "status": "packet-only-not-deployed", "counts": { "rows": 6912, "physicalRows": 3456, "evidencePairs": 3456, "evidencePairComparisons": 656640, "columns": 192, "sources": 20, "claimNodes": 16, "normalizedProxyEquations": 20, "exactIntegerLedgerEquations": 16, "exactIntegerLedgers": 3, "prohibitedZeroFields": 112 }, "axes": [ { "id": "cmp_family", "count": 6, "values": [ "copper-interconnect-cmp-like", "tungsten-contact-cmp-like", "dielectric-planarization-cmp-like", "shallow-trench-isolation-cmp-like", "advanced-metal-cmp-like", "post-cmp-clean-handoff-like" ], "meaning": "Six bounded CMP and post-CMP-clean family vocabularies; not transferable films, materials, chemistries, abrasives, settings, conditions, tools, recipes, or acceptance limits." }, { "id": "carrier_kinematics_mode", "count": 2, "values": [ "carrier-profile-centered-like", "platen-kinematics-centered-like" ], "meaning": "Two categorical emphasis modes separating carrier pressure-profile response from platen and relative-motion response; not tuning, scheduling, dispatch, or equipment control." }, { "id": "pad_condition_state", "count": 3, "values": [ "pad-contact-constrained-like", "conditioner-transition-like", "pad-condition-supported-like" ], "meaning": "Categorical pad contact and conditioner posture; not pad material, hardness, topography, wear, force, speed, contact area, lifetime, or acceptance limit." }, { "id": "slurry_removal_state", "count": 3, "values": [ "slurry-chemistry-constrained-like", "mechanical-removal-constrained-like", "slurry-removal-supported-like" ], "meaning": "Categorical slurry-delivery and chemical-mechanical removal posture; not chemistry, abrasive, additive, concentration, flow, removal rate, selectivity, or material state." }, { "id": "topography_defect_state", "count": 2, "values": [ "topography-defect-constrained-like", "topography-defect-supported-like" ], "meaning": "Categorical removal-uniformity, dishing, erosion, and scratch posture; not layout geometry, depth, density, roughness, defect count, or disposition." }, { "id": "endpoint_clean_state", "count": 2, "values": [ "endpoint-clean-supported-like", "endpoint-clean-constrained-like" ], "meaning": "Categorical endpoint and post-CMP-clean posture; not signal, threshold, time, film value, cleaning chemistry, residue result, equipment action, or disposition." }, { "id": "ordered_state", "count": 8, "values": [ "cmp-state-a", "cmp-state-b", "cmp-state-c", "cmp-state-d", "cmp-state-e", "cmp-state-f", "cmp-state-g", "cmp-state-h" ], "meaning": "Eight ordered non-time teaching states; not wafer route, process sequence, polish duration, endpoint time, overpolish, clean time, queue time, or recipe step." }, { "id": "evidence_posture", "count": 2, "values": [ "teaching_assumption", "replacement_slot" ], "meaning": "Paired evidence metadata only; physical values are identical across each adjacent pair." } ], "ranges": { "ordered_state_norm": { "min": 0, "max": 1 }, "carrier_pressure_readiness_proxy": { "min": 0.4204, "max": 0.893714286 }, "pad_condition_readiness_proxy": { "min": 0.456488, "max": 0.871017143 }, "slurry_delivery_readiness_proxy": { "min": 0.4902, "max": 0.867457143 }, "removal_control_readiness_proxy": { "min": 0.45426224, "max": 0.8590296 }, "topography_control_readiness_proxy": { "min": 0.5276, "max": 0.8684 }, "scratch_control_readiness_proxy": { "min": 0.4972, "max": 0.8708 }, "cmp_progress_proxy": { "min": 0.495914138, "max": 0.866399104 }, "pattern_topography_burden_proxy": { "min": 0.212938013, "max": 0.713470736 }, "dishing_erosion_burden_proxy": { "min": 0.200530474, "max": 0.576298476 }, "residual_scratch_burden_proxy": { "min": 0.236871545, "max": 0.633788943 }, "removal_uniformity_readiness_proxy": { "min": 0.545755037, "max": 0.849905733 }, "endpoint_signal_readiness_proxy": { "min": 0.611936266, "max": 0.838182914 }, "within_wafer_removal_uniformity_readiness_proxy": { "min": 0.568002044, "max": 0.839969434 }, "overpolish_burden_proxy": { "min": 0.26624991, "max": 0.700798596 }, "cmp_process_drift_burden_proxy": { "min": 0.205142857, "max": 0.6724 }, "model_limit_burden_proxy": { "min": 0.2936, "max": 0.6996 }, "metrology_readiness_proxy": { "min": 0.588488915, "max": 0.823854268 }, "post_cmp_clean_readiness_proxy": { "min": 0.581369595, "max": 0.821814699 }, "cmp_handoff_readiness_proxy": { "min": 0.59430118, "max": 0.832411985 } }, "distributions": { "cmpRegime": { "pad-condition-limited": 1056, "carrier-pressure-limited": 696, "bounded-cmp-review": 3926, "scratch-defect-limited": 664, "endpoint-clean-readiness-limited": 216, "slurry-removal-control-limited": 256, "removal-uniformity-limited": 62, "dishing-erosion-limited": 36 }, "labels": { "cmp_operator_gate": { "review-pad-condition": 1056, "review-carrier-pressure": 696, "review-process-drift": 1026, "proceed-to-evidence-review": 2900, "review-scratch-defect": 664, "review-endpoint-clean": 216, "review-slurry-removal": 256, "review-removal-uniformity": 62, "review-dishing-erosion": 36 }, "cmp_process_engineer_gate": { "review-pad-condition-model": 1056, "review-pressure-model": 696, "bounded-comparison-ready": 3774, "review-defect-model": 664, "review-endpoint-clean-model": 216, "review-slurry-removal-model": 256, "review-uniformity-model": 62, "review-model-limit": 152, "review-topography-model": 36 }, "integration_gate": { "cmp-handoff-blocked": 6912 }, "yield_gate": { "review-cmp-progress": 956, "review-scratch-defect": 818, "bounded-teaching-review": 4612, "review-post-cmp-clean": 154, "review-metrology": 368, "review-endpoint-uniformity": 4 }, "measurement_traceability_gate": { "measurement-plan-required": 1412, "owned-measurement-replacement-required": 5500 }, "upstream_clean_surface_readiness_band": { "limited-like": 282, "transitional-like": 4086, "bounded-like": 2544 }, "upstream_clean_particle_residue_risk_band": { "intermediate-like": 4294, "higher-like": 388, "lower-like": 2230 }, "upstream_clean_evidence_gate": { "replacement-evidence-required": 6912 }, "upstream_ecd_overburden_band": { "lower-like": 2306, "intermediate-like": 3868, "higher-like": 738 }, "upstream_ecd_fill_continuity_band": { "bounded-like": 4256, "transitional-like": 2538, "limited-like": 118 }, "upstream_ecd_evidence_gate": { "replacement-evidence-required": 6912 }, "upstream_film_uniformity_band": { "bounded-like": 4826, "transitional-like": 1774, "limited-like": 312 }, "upstream_film_topography_risk_band": { "lower-like": 4636, "intermediate-like": 2224, "higher-like": 52 }, "upstream_film_evidence_gate": { "replacement-evidence-required": 6912 }, "post_cmp_clean_readiness_band": { "bounded-like": 4822, "transitional-like": 2058, "limited-like": 32 }, "downstream_endpoint_sensor_readiness_band": { "transitional-like": 1352, "limited-like": 634, "bounded-like": 4926 }, "downstream_endpoint_signal_separation_band": { "transitional-like": 1542, "bounded-like": 5342, "limited-like": 28 }, "downstream_endpoint_drift_priority_band": { "high-priority": 600, "review-like": 4224, "lower-priority": 2088 }, "downstream_false_endpoint_priority_band": { "high-priority": 1684, "review-like": 4114, "lower-priority": 1114 }, "downstream_metrology_priority_band": { "pad-condition": 1092, "carrier-pressure": 524, "scratch-defect": 388, "slurry-removal": 528, "drift-series": 786, "removal-uniformity": 248, "endpoint-signal": 446, "completion-state": 2392, "model-limit": 466, "dishing-erosion": 18, "post-cmp-clean": 24 }, "downstream_endpoint_evidence_gate": { "replacement-evidence-required": 6912 }, "downstream_metrology_evidence_gate": { "replacement-evidence-required": 6912 }, "teaching_cmp_handoff_gate": { "blocked-pending-owned-evidence": 6912 } } }, "representativeStates": [ { "physical_key": "copper-interconnect-cmp-like|carrier-profile-centered-like|pad-contact-constrained-like|slurry-chemistry-constrained-like|topography-defect-constrained-like|endpoint-clean-supported-like|cmp-state-f", "cmp_family": "copper-interconnect-cmp-like", "carrier_kinematics_mode": "carrier-profile-centered-like", "pad_condition_state": "pad-contact-constrained-like", "slurry_removal_state": "slurry-chemistry-constrained-like", "topography_defect_state": "topography-defect-constrained-like", "endpoint_clean_state": "endpoint-clean-supported-like", "ordered_state": "cmp-state-f", "cmp_regime": "carrier-pressure-limited", "ordered_state_norm": 0.714285714, "carrier_pressure_readiness_proxy": 0.465485714, "pad_condition_readiness_proxy": 0.473606857, "slurry_delivery_readiness_proxy": 0.547571429, "removal_control_readiness_proxy": 0.612245646, "topography_control_readiness_proxy": 0.703885714, "scratch_control_readiness_proxy": 0.595485714, "cmp_progress_proxy": 0.643636326, "pattern_topography_burden_proxy": 0.446929498, "dishing_erosion_burden_proxy": 0.396604336, "residual_scratch_burden_proxy": 0.568946646, "removal_uniformity_readiness_proxy": 0.679121069, "endpoint_signal_readiness_proxy": 0.677170597, "within_wafer_removal_uniformity_readiness_proxy": 0.720189854, "overpolish_burden_proxy": 0.631487801, "cmp_process_drift_burden_proxy": 0.514628571, "model_limit_burden_proxy": 0.579085714, "metrology_readiness_proxy": 0.688375713, "post_cmp_clean_readiness_proxy": 0.671764593, "cmp_handoff_readiness_proxy": 0.673595678, "cmp_operator_gate": "review-carrier-pressure", "cmp_process_engineer_gate": "review-pressure-model", "integration_gate": "cmp-handoff-blocked", "yield_gate": "review-scratch-defect", "downstream_metrology_priority_band": "carrier-pressure" }, { "physical_key": "copper-interconnect-cmp-like|carrier-profile-centered-like|pad-contact-constrained-like|slurry-chemistry-constrained-like|topography-defect-constrained-like|endpoint-clean-supported-like|cmp-state-a", "cmp_family": "copper-interconnect-cmp-like", "carrier_kinematics_mode": "carrier-profile-centered-like", "pad_condition_state": "pad-contact-constrained-like", "slurry_removal_state": "slurry-chemistry-constrained-like", "topography_defect_state": "topography-defect-constrained-like", "endpoint_clean_state": "endpoint-clean-supported-like", "ordered_state": "cmp-state-a", "cmp_regime": "pad-condition-limited", "ordered_state_norm": 0, "carrier_pressure_readiness_proxy": 0.4984, "pad_condition_readiness_proxy": 0.480848, "slurry_delivery_readiness_proxy": 0.529, "removal_control_readiness_proxy": 0.52418352, "topography_control_readiness_proxy": 0.7596, "scratch_control_readiness_proxy": 0.6512, "cmp_progress_proxy": 0.539549645, "pattern_topography_burden_proxy": 0.356094966, "dishing_erosion_burden_proxy": 0.343570891, "residual_scratch_burden_proxy": 0.558942099, "removal_uniformity_readiness_proxy": 0.742616403, "endpoint_signal_readiness_proxy": 0.669084921, "within_wafer_removal_uniformity_readiness_proxy": 0.763555683, "overpolish_burden_proxy": 0.618688316, "cmp_process_drift_burden_proxy": 0.5832, "model_limit_burden_proxy": 0.4648, "metrology_readiness_proxy": 0.653891756, "post_cmp_clean_readiness_proxy": 0.691294842, "cmp_handoff_readiness_proxy": 0.656048172, "cmp_operator_gate": "review-pad-condition", "cmp_process_engineer_gate": "review-pad-condition-model", "integration_gate": "cmp-handoff-blocked", "yield_gate": "review-cmp-progress", "downstream_metrology_priority_band": "pad-condition" }, { "physical_key": "copper-interconnect-cmp-like|carrier-profile-centered-like|conditioner-transition-like|slurry-chemistry-constrained-like|topography-defect-constrained-like|endpoint-clean-supported-like|cmp-state-h", "cmp_family": "copper-interconnect-cmp-like", "carrier_kinematics_mode": "carrier-profile-centered-like", "pad_condition_state": "conditioner-transition-like", "slurry_removal_state": "slurry-chemistry-constrained-like", "topography_defect_state": "topography-defect-constrained-like", "endpoint_clean_state": "endpoint-clean-supported-like", "ordered_state": "cmp-state-h", "cmp_regime": "slurry-removal-control-limited", "ordered_state_norm": 1, "carrier_pressure_readiness_proxy": 0.606, "pad_condition_readiness_proxy": 0.61252, "slurry_delivery_readiness_proxy": 0.519, "removal_control_readiness_proxy": 0.6735848, "topography_control_readiness_proxy": 0.6816, "scratch_control_readiness_proxy": 0.5732, "cmp_progress_proxy": 0.719900352, "pattern_topography_burden_proxy": 0.448562736, "dishing_erosion_burden_proxy": 0.37647675, "residual_scratch_burden_proxy": 0.499208483, "removal_uniformity_readiness_proxy": 0.656498981, "endpoint_signal_readiness_proxy": 0.695845755, "within_wafer_removal_uniformity_readiness_proxy": 0.706174777, "overpolish_burden_proxy": 0.556673319, "cmp_process_drift_burden_proxy": 0.5592, "model_limit_burden_proxy": 0.6248, "metrology_readiness_proxy": 0.7176687, "post_cmp_clean_readiness_proxy": 0.680749572, "cmp_handoff_readiness_proxy": 0.700862835, "cmp_operator_gate": "review-slurry-removal", "cmp_process_engineer_gate": "review-slurry-removal-model", "integration_gate": "cmp-handoff-blocked", "yield_gate": "bounded-teaching-review", "downstream_metrology_priority_band": "slurry-removal" }, { "physical_key": "copper-interconnect-cmp-like|carrier-profile-centered-like|conditioner-transition-like|slurry-chemistry-constrained-like|topography-defect-constrained-like|endpoint-clean-constrained-like|cmp-state-a", "cmp_family": "copper-interconnect-cmp-like", "carrier_kinematics_mode": "carrier-profile-centered-like", "pad_condition_state": "conditioner-transition-like", "slurry_removal_state": "slurry-chemistry-constrained-like", "topography_defect_state": "topography-defect-constrained-like", "endpoint_clean_state": "endpoint-clean-constrained-like", "ordered_state": "cmp-state-a", "cmp_regime": "removal-uniformity-limited", "ordered_state_norm": 0, "carrier_pressure_readiness_proxy": 0.6732, "pad_condition_readiness_proxy": 0.627304, "slurry_delivery_readiness_proxy": 0.529, "removal_control_readiness_proxy": 0.52573296, "topography_control_readiness_proxy": 0.6756, "scratch_control_readiness_proxy": 0.5952, "cmp_progress_proxy": 0.55073271, "pattern_topography_burden_proxy": 0.425496067, "dishing_erosion_burden_proxy": 0.396863427, "residual_scratch_burden_proxy": 0.507763157, "removal_uniformity_readiness_proxy": 0.660904315, "endpoint_signal_readiness_proxy": 0.63593965, "within_wafer_removal_uniformity_readiness_proxy": 0.655421178, "overpolish_burden_proxy": 0.569307668, "cmp_process_drift_burden_proxy": 0.6376, "model_limit_burden_proxy": 0.5208, "metrology_readiness_proxy": 0.617293024, "post_cmp_clean_readiness_proxy": 0.648978551, "cmp_handoff_readiness_proxy": 0.627317572, "cmp_operator_gate": "review-removal-uniformity", "cmp_process_engineer_gate": "review-uniformity-model", "integration_gate": "cmp-handoff-blocked", "yield_gate": "review-cmp-progress", "downstream_metrology_priority_band": "slurry-removal" }, { "physical_key": "tungsten-contact-cmp-like|platen-kinematics-centered-like|conditioner-transition-like|slurry-chemistry-constrained-like|topography-defect-constrained-like|endpoint-clean-constrained-like|cmp-state-h", "cmp_family": "tungsten-contact-cmp-like", "carrier_kinematics_mode": "platen-kinematics-centered-like", "pad_condition_state": "conditioner-transition-like", "slurry_removal_state": "slurry-chemistry-constrained-like", "topography_defect_state": "topography-defect-constrained-like", "endpoint_clean_state": "endpoint-clean-constrained-like", "ordered_state": "cmp-state-h", "cmp_regime": "dishing-erosion-limited", "ordered_state_norm": 1, "carrier_pressure_readiness_proxy": 0.6248, "pad_condition_readiness_proxy": 0.642256, "slurry_delivery_readiness_proxy": 0.5642, "removal_control_readiness_proxy": 0.66786544, "topography_control_readiness_proxy": 0.5388, "scratch_control_readiness_proxy": 0.5388, "cmp_progress_proxy": 0.707602906, "pattern_topography_burden_proxy": 0.556328221, "dishing_erosion_burden_proxy": 0.483969885, "residual_scratch_burden_proxy": 0.518468928, "removal_uniformity_readiness_proxy": 0.614005742, "endpoint_signal_readiness_proxy": 0.646192613, "within_wafer_removal_uniformity_readiness_proxy": 0.591390891, "overpolish_burden_proxy": 0.588915394, "cmp_process_drift_burden_proxy": 0.6076, "model_limit_burden_proxy": 0.6876, "metrology_readiness_proxy": 0.662998988, "post_cmp_clean_readiness_proxy": 0.627925855, "cmp_handoff_readiness_proxy": 0.648049374, "cmp_operator_gate": "review-dishing-erosion", "cmp_process_engineer_gate": "review-topography-model", "integration_gate": "cmp-handoff-blocked", "yield_gate": "review-post-cmp-clean", "downstream_metrology_priority_band": "endpoint-signal" }, { "physical_key": "copper-interconnect-cmp-like|carrier-profile-centered-like|pad-contact-constrained-like|slurry-removal-supported-like|topography-defect-constrained-like|endpoint-clean-constrained-like|cmp-state-c", "cmp_family": "copper-interconnect-cmp-like", "carrier_kinematics_mode": "carrier-profile-centered-like", "pad_condition_state": "pad-contact-constrained-like", "slurry_removal_state": "slurry-removal-supported-like", "topography_defect_state": "topography-defect-constrained-like", "endpoint_clean_state": "endpoint-clean-constrained-like", "ordered_state": "cmp-state-c", "cmp_regime": "scratch-defect-limited", "ordered_state_norm": 0.285714286, "carrier_pressure_readiness_proxy": 0.516914286, "pad_condition_readiness_proxy": 0.530521143, "slurry_delivery_readiness_proxy": 0.807971429, "removal_control_readiness_proxy": 0.598164503, "topography_control_readiness_proxy": 0.653314286, "scratch_control_readiness_proxy": 0.572914286, "cmp_progress_proxy": 0.582519709, "pattern_topography_burden_proxy": 0.446732675, "dishing_erosion_burden_proxy": 0.447998938, "residual_scratch_burden_proxy": 0.507521745, "removal_uniformity_readiness_proxy": 0.636713957, "endpoint_signal_readiness_proxy": 0.639698112, "within_wafer_removal_uniformity_readiness_proxy": 0.639524178, "overpolish_burden_proxy": 0.5626865, "cmp_process_drift_burden_proxy": 0.510228571, "model_limit_burden_proxy": 0.511314286, "metrology_readiness_proxy": 0.632260861, "post_cmp_clean_readiness_proxy": 0.643577542, "cmp_handoff_readiness_proxy": 0.639827347, "cmp_operator_gate": "review-scratch-defect", "cmp_process_engineer_gate": "review-defect-model", "integration_gate": "cmp-handoff-blocked", "yield_gate": "review-cmp-progress", "downstream_metrology_priority_band": "pad-condition" }, { "physical_key": "copper-interconnect-cmp-like|carrier-profile-centered-like|conditioner-transition-like|slurry-chemistry-constrained-like|topography-defect-constrained-like|endpoint-clean-supported-like|cmp-state-g", "cmp_family": "copper-interconnect-cmp-like", "carrier_kinematics_mode": "carrier-profile-centered-like", "pad_condition_state": "conditioner-transition-like", "slurry_removal_state": "slurry-chemistry-constrained-like", "topography_defect_state": "topography-defect-constrained-like", "endpoint_clean_state": "endpoint-clean-supported-like", "ordered_state": "cmp-state-g", "cmp_regime": "endpoint-clean-readiness-limited", "ordered_state_norm": 0.857142857, "carrier_pressure_readiness_proxy": 0.623142857, "pad_condition_readiness_proxy": 0.616291429, "slurry_delivery_readiness_proxy": 0.533285714, "removal_control_readiness_proxy": 0.660489943, "topography_control_readiness_proxy": 0.692742857, "scratch_control_readiness_proxy": 0.584342857, "cmp_progress_proxy": 0.700631872, "pattern_topography_burden_proxy": 0.429582667, "dishing_erosion_burden_proxy": 0.362727691, "residual_scratch_burden_proxy": 0.493016722, "removal_uniformity_readiness_proxy": 0.669263101, "endpoint_signal_readiness_proxy": 0.695488098, "within_wafer_removal_uniformity_readiness_proxy": 0.714926007, "overpolish_burden_proxy": 0.552101745, "cmp_process_drift_burden_proxy": 0.524914286, "model_limit_burden_proxy": 0.601942857, "metrology_readiness_proxy": 0.711690749, "post_cmp_clean_readiness_proxy": 0.685285772, "cmp_handoff_readiness_proxy": 0.698744466, "cmp_operator_gate": "review-endpoint-clean", "cmp_process_engineer_gate": "review-endpoint-clean-model", "integration_gate": "cmp-handoff-blocked", "yield_gate": "bounded-teaching-review", "downstream_metrology_priority_band": "slurry-removal" }, { "physical_key": "copper-interconnect-cmp-like|carrier-profile-centered-like|pad-contact-constrained-like|slurry-removal-supported-like|topography-defect-constrained-like|endpoint-clean-supported-like|cmp-state-a", "cmp_family": "copper-interconnect-cmp-like", "carrier_kinematics_mode": "carrier-profile-centered-like", "pad_condition_state": "pad-contact-constrained-like", "slurry_removal_state": "slurry-removal-supported-like", "topography_defect_state": "topography-defect-constrained-like", "endpoint_clean_state": "endpoint-clean-supported-like", "ordered_state": "cmp-state-a", "cmp_regime": "bounded-cmp-review", "ordered_state_norm": 0, "carrier_pressure_readiness_proxy": 0.4984, "pad_condition_readiness_proxy": 0.526448, "slurry_delivery_readiness_proxy": 0.7794, "removal_control_readiness_proxy": 0.59021552, "topography_control_readiness_proxy": 0.7596, "scratch_control_readiness_proxy": 0.6512, "cmp_progress_proxy": 0.564517325, "pattern_topography_burden_proxy": 0.305809206, "dishing_erosion_burden_proxy": 0.331788778, "residual_scratch_burden_proxy": 0.483226269, "removal_uniformity_readiness_proxy": 0.746639264, "endpoint_signal_readiness_proxy": 0.685505584, "within_wafer_removal_uniformity_readiness_proxy": 0.768383116, "overpolish_burden_proxy": 0.527575078, "cmp_process_drift_burden_proxy": 0.5004, "model_limit_burden_proxy": 0.4096, "metrology_readiness_proxy": 0.670297598, "post_cmp_clean_readiness_proxy": 0.710497515, "cmp_handoff_readiness_proxy": 0.682283853, "cmp_operator_gate": "review-process-drift", "cmp_process_engineer_gate": "bounded-comparison-ready", "integration_gate": "cmp-handoff-blocked", "yield_gate": "review-cmp-progress", "downstream_metrology_priority_band": "pad-condition" } ], "sourceSummary": { "sources": 20, "claimNodes": 16, "linkStatus": "pass", "reachable": 16, "accessGated": 4, "hardFailures": 0, "networkErrors": 0, "sourceBodiesStored": false, "sourceNumericUse": "none" }, "currentPublicBaseline": { "version": "v109", "versionId": "appgprj_6a6f4d3affc0819189d99a8f29062540~appgver_005d791cd0f881919fe28dce4fc90e8f", "deploymentId": "appgdep_6a91677cd40081919caf523a472130f6", "sourceCommit": "c3888cc26eb434d9ca88e76889f781194044db4a", "changedByThisPacket": false, "publicVersionReserved": "none", "releaseDecision": "hold" }, "publicDelivery": { "mode": "metadata-manifest-plus-csv-rows", "rowsEmbedded": false, "rowArtifact": "cmp-state-v1.csv", "rowArtifactSha256": "8FD209DEE183FD4D1D2AA34C51694B7C7571114C72F1F816EEBFFF2F4E85F337", "canonicalRowBearingArtifact": "cmp-state-web-v1.json", "canonicalRowBearingArtifactSha256": "668649326149E874DC4902A7F6AB537BF6FF635AEF81C831AA4BFCF68AF81B58", "independentValidationArtifact": "validation-report-v1.json", "independentValidationArtifactSha256": "4DBDC3D1150F242A06541F182AAB1EE3713DFC5F83B70B6C8A0658CDAC0840F0", "sourceSpineArtifact": "cmp-source-spine-v1.json", "sourceSpineArtifactSha256": "CC0F9B4B73C04EF2EE896D539E89402534FA0BA82AD5978483BCADC8BAA3336C", "publicHoldArtifact": "public-hold-verification-v1.json", "publicHoldArtifactSha256": "D72932A8BD52BDDAC3F0C31263D70D38E0342D6C30B96AB4D0DD25D994303E0A" }, "contracts": { "state": { "file": "cmp-state-contract-v1.json", "sha256": "F376813E1AFD12297E1E67E57B6630E366490447491E19BDAB78DF1C3F0C3762" }, "metrics": { "file": "cmp-metric-contract-v1.json", "sha256": "DB83F39DA1EABF723891C58C65D0DD375614D2287786F9F98E9C53F3F8E21A32" }, "verifier": { "file": "independent-verifier-contract-v1.json", "sha256": "EFE287558F9C100A7F3E6A88CEFB24E83972B93E6D52706B1A3596DB1CF7FB75" }, "sourceCatalog": { "file": "source_catalog_v1.json", "sha256": "D2843ADB2439C36E32A850CD4A8B796178590708847237D93AEE622F0D932B8E" }, "claimMap": { "file": "source_claim_map_v1.json", "sha256": "E90401C9B6F32BD53D712B947020F5A74BD59070452908CFF076A5271492DCC3" } }, "cmpRegimes": [ "carrier-pressure-limited", "pad-condition-limited", "slurry-removal-control-limited", "removal-uniformity-limited", "dishing-erosion-limited", "scratch-defect-limited", "endpoint-clean-readiness-limited", "bounded-cmp-review" ], "requiredPhenomena": [ "cmp-family-and-carrier-kinematics-separation", "pad-contact-and-conditioner-state-separation", "slurry-chemistry-and-mechanical-removal-separation", "pressure-relative-velocity-and-removal-uniformity-response", "dishing-erosion-and-pattern-topography-response", "scratch-particle-residue-and-defect-response", "endpoint-post-cmp-clean-and-metrology-handoff", "traceability-model-limit-and-owned-evidence-boundary" ], "upstreamBridges": [ { "sourceExperimentId": "SA-PROC-CLEAN-SURFACE-027", "allowedFields": [ "downstream_cmp_surface_readiness_band", "downstream_cmp_particle_residue_risk_band", "downstream_cmp_oxide_wetting_band", "downstream_cmp_adhesion_readiness_band", "downstream_cmp_collapse_priority_band", "downstream_metrology_priority_band", "downstream_cmp_evidence_gate", "downstream_metrology_evidence_gate", "teaching_clean_surface_handoff_gate" ], "physicalUnitsAllowed": false, "automaticStateImportAllowed": false }, { "sourceExperimentId": "SA-PROC-DEP-ECD-GAPFILL-023", "allowedFields": [ "downstream_cmp_overburden_band", "downstream_cmp_entry_uniformity_band", "downstream_cmp_evidence_gate", "downstream_fill_continuity_band", "downstream_void_seam_priority_band", "downstream_current_uniformity_band", "downstream_metrology_priority_band", "downstream_inspection_evidence_gate", "teaching_ecd_gapfill_handoff_gate" ], "physicalUnitsAllowed": false, "automaticStateImportAllowed": false }, { "sourceExperimentId": "SA-PROC-DEP-PVD-012", "allowedFields": [ "downstream_thickness_uniformity_band", "downstream_step_coverage_band", "downstream_stress_priority_band", "downstream_metrology_priority_band", "downstream_film_evidence_gate", "teaching_deposition_handoff_gate" ], "physicalUnitsAllowed": false, "automaticStateImportAllowed": false }, { "sourceExperimentId": "SA-PROC-DEP-CVD-PECVD-013", "allowedFields": [ "downstream_thickness_uniformity_band", "downstream_conformality_band", "downstream_stress_damage_priority_band", "downstream_metrology_priority_band", "downstream_film_evidence_gate", "teaching_cvd_handoff_gate" ], "physicalUnitsAllowed": false, "automaticStateImportAllowed": false } ], "downstreamBridge": { "targetExperimentId": "SA-EQP-ENDPOINT-SENSOR-029", "allowedFields": [ "downstream_endpoint_sensor_readiness_band", "downstream_endpoint_signal_separation_band", "downstream_endpoint_drift_priority_band", "downstream_false_endpoint_priority_band", "downstream_metrology_priority_band", "downstream_endpoint_evidence_gate", "downstream_metrology_evidence_gate", "teaching_cmp_handoff_gate" ], "physicalUnitsAllowed": false, "automaticRecipeHandoffAllowed": false, "automaticSensorThresholdHandoffAllowed": false, "automaticEquipmentActionAllowed": false, "automaticDispositionAllowed": false }, "replacementEvidenceRequirements": [ "accountable run, lot, wafer, CMP, post-CMP-clean, metrology, integration, yield, equipment, and disposition ownership", "revisioned carrier head, retaining ring, platen, pad, conditioner, slurry delivery, cleaning, endpoint, transport, and measurement configuration", "owned incoming clean-surface, ECD gap-fill, PVD, CVD/PECVD, film-stack, material, topography, defect, substrate, and queue histories", "owned carrier-zone pressure, backside pressure, retaining-ring, platen speed, head speed, relative-velocity, sweep, position, and alignment evidence", "owned pad identity, hardness, porosity, groove, asperity, roughness, break-in, glazing, wear, temperature, contact, and lifetime evidence", "owned conditioner identity, abrasive, force, speed, sweep, contact area, pad-cut response, wear, debris, and maintenance evidence", "owned slurry identity, purity, abrasive family and distribution, agglomeration, additives, concentration, pH, redox, flow, temperature, filtration, and delivery evidence", "owned pressure-contact, friction, lubrication, chemical-reaction, abrasion, removal, selectivity, and temperature evidence", "owned incoming thickness, target thickness, removal rate, within-wafer, wafer-to-wafer, edge, carrier-zone, pattern-dependent, and temporal uniformity evidence", "owned pattern geometry, density, overburden, dishing, erosion, recess, topography, overpolish, and material-interface evidence", "owned scratch, particle, pad-debris, residue, corrosion, roughness, defect location, mechanism, inspection, and disposition evidence", "owned optical, acoustic, friction, electrical, film, profile, endpoint, drift, false-endpoint, stop, and fault-detection evidence", "owned post-CMP brush, fluid, chemistry, particle, residue, corrosion, rinse, dry, watermark, recontamination, and surface-qualification evidence", "owned film, topography, defect, particle, residue, corrosion, and endpoint metrology with calibration, uncertainty, sampling, raw-data lineage, and review evidence", "explicit validation of every contact, lubrication, reaction, abrasion, removal, pad-wear, topography, defect, endpoint, and cleaning model before use", "documented confirmation that no normalized label is used as a slurry choice, pressure, speed, force, threshold, process limit, equipment command, acceptance criterion, or production decision" ], "requiredSections": [ "Explore", "Run Card", "Export", "Methods", "Limits", "Evidence" ], "limitation": "Original dimensionless CMP teaching replay only. No physical pressure, speed, force, contact, friction, pad condition, slurry chemistry, concentration, flow, temperature, removal rate, thickness, uniformity, dishing, erosion, scratch, particle, residue, endpoint threshold, post-CMP-clean result, metrology result, equipment action, recipe, qualification, disposition, or production fitness is computed or implied." }