{
  "schema": "semiagora.endpoint-sensor-source-spine.v1",
  "version": "2026-08-30-endpoint-sensor-v1",
  "experimentId": "SA-EQP-ENDPOINT-SENSOR-029",
  "generatedAt": "2026-08-30T00:00:00+09:00",
  "sourceBodiesStored": false,
  "sourceNumericUse": "none",
  "rightsMode": "link-only",
  "sourceCount": 20,
  "claimNodeCount": 16,
  "inputHashesSha256": {
    "endpoint-sensor-state-contract-v1.json": "F9012526006A30F46CEA55D64ECC15779630D69EE47DC1AD61DBAF6FFF46B3EF",
    "endpoint-sensor-metric-contract-v1.json": "E4C91109F088851F2FD5B6F4F9056DDB0EAA3731289E970D8EA8B63C16C87798",
    "source_catalog_v1.json": "AB51A7B6A9A076FDDFBA812909F8E5F68E1BD8BE6311B5B28300213EEE262A2D",
    "source_claim_map_v1.json": "CE15FE76D8A14FA784B4BA77AC6E5FC5377D3BFE76022F97ED23AB86769F37C0",
    "independent-verifier-contract-v1.json": "7ECE72B6378482798C50928E2CE5CFADBC5789664F17DD3A78609DCE3EC1A75F"
  },
  "sources": [
    {
      "id": "horiba-ev140c-oes",
      "label": "EV-140C Optical Emission Spectroscopy Etching End-point Monitor",
      "publisher": "HORIBA, Ltd.",
      "url": "https://www.horiba.com/sgp/semiconductor/products/detail/action/show/Product/ev-140c-676/",
      "sourceType": "official-technical-page-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "OES signal collection, endpoint and chamber-condition monitoring, spectral-trend, noise-immunity, and equipment-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "horiba-lem-interferometry",
      "label": "LEM Series camera endpoint monitor based on real-time laser interferometry",
      "publisher": "HORIBA France SAS",
      "url": "https://www.horiba.com/ind/semiconductor/products/detail/action/show/Product/lem-series-3254/",
      "sourceType": "official-technical-page-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Interferometric etch/deposition monitoring, reflected-light path, fringe, interface, thickness/depth, endpoint, and optical-access vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "inficon-transpector-apx",
      "label": "Transpector APX ALD Single Pressure residual gas analyzer",
      "publisher": "INFICON",
      "url": "https://www.inficon.com/en/products/gas-analysis/transpector-apx-ald-single-pressure",
      "sourceType": "official-technical-page-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "RGA process monitoring for ALD, CVD, PVD, etch, chamber-clean endpoint, inlet-path, gas-species, and contamination-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "inficon-rf-sensing",
      "label": "RF Sensing Technology for plasma monitoring",
      "publisher": "INFICON",
      "url": "https://www.inficon.com/en/products/rf-sensing-technology",
      "sourceType": "official-technical-page-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Non-invasive RF sensing, arc and clean-endpoint monitoring, electrical-signal, integration, and equipment-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "mks-baratron-etch",
      "label": "Baratron manometer enables plasma etch process",
      "publisher": "MKS Instruments",
      "url": "https://www.mks.com/n/baratron-manometer-enables-plasma-etch-process",
      "sourceType": "official-technical-page-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Capacitance-manometer pressure measurement, corrosive-environment stability, pressure-transient, drift, and calibration-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "horiba-infrared-thermometer",
      "label": "Infrared Thermometer for semiconductor deposition processes",
      "publisher": "HORIBA, Ltd.",
      "url": "https://www.horiba.com/usa/semiconductor/process/deposition/infrared-thermometer/",
      "sourceType": "official-technical-page-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Non-contact temperature sensing, infrared sensor, process stabilization, environmental response, and calibration-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "zhang-ibe-oes-2022",
      "label": "An Endpoint Detection System for Ion Beam Etching Using Optical Emission Spectroscopy",
      "publisher": "MDPI / Micromachines",
      "url": "https://doi.org/10.3390/mi13020259",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "OES endpoint-system architecture, optical collection path, multilayer transition, sensitivity, viewport attenuation, and signal-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "multiwavelength-oes-small-area-2001",
      "label": "Plasma etching endpoint detection using multiple wavelengths for small open-area wafers",
      "publisher": "AIP Publishing / Journal of Vacuum Science & Technology A",
      "url": "https://doi.org/10.1116/1.1331294",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Multiple-wavelength OES, small-open-area sensitivity, signal selection, endpoint transition, and noise-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "modified-gmm-oes-2020",
      "label": "Sensitivity Enhancement of SiO2 Plasma Etching Endpoint Detection Using Modified Gaussian Mixture Model",
      "publisher": "IEEE / Transactions on Semiconductor Manufacturing",
      "url": "https://doi.org/10.1109/TSM.2020.2973818",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Full-spectrum OES, low-signal endpoint detection, statistical feature separation, sensitivity, and algorithm-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "layadi-interferometry-cmos-1999",
      "label": "Interferometry for end point prediction during plasma etching of various structures in CMOS device fabrication",
      "publisher": "AIP Publishing / Journal of Vacuum Science & Technology B",
      "url": "https://doi.org/10.1116/1.591037",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Interferometric endpoint prediction, reflected-light response, multilayer structures, process transition, and optical-model-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "plasma-emission-interferometry-2015",
      "label": "In-situ monitoring of etch uniformity using plasma emission interferometry",
      "publisher": "AIP Publishing / Journal of Vacuum Science & Technology A",
      "url": "https://doi.org/10.1116/1.4917168",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Plasma-emission interferometry, spatial etch response, endpoint and uniformity monitoring, signal interpretation, and model-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "clarke-mass-spectrometry-1985",
      "label": "Mass spectrometric studies of plasma etching of silicon nitride",
      "publisher": "AIP Publishing / Journal of Vacuum Science & Technology A",
      "url": "https://doi.org/10.1116/1.582949",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Mass-spectrometric plasma species, interface response, sampling path, fragmentation, endpoint, and interpretation-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "priebe-tofms-ald-2022",
      "label": "Real-Time In Situ Parallel Detection of Elements and Molecules with TOFMS during ALD for Chemical Quality Control of Thin Films",
      "publisher": "ACS / Journal of Physical Chemistry C",
      "url": "https://doi.org/10.1021/acs.jpcc.1c09544",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "In-situ mass-spectrometry for deposition, parallel species detection, process deviation, chemical-quality monitoring, and endpoint-control-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "plasma-impedance-endpoint-2010",
      "label": "Plasma impedance monitoring for real time endpoint detection of bulk materials etched in ICP tool",
      "publisher": "Elsevier / Microelectronic Engineering",
      "url": "https://doi.org/10.1016/j.mee.2010.03.003",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "RF plasma-impedance harmonics, electrical transition, endpoint, pressure/process context, repeatability, and validation-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "jang-pim-mpca-2013",
      "label": "Real-Time Endpoint Detection of Small Exposed Area SiO2 Films Using Plasma Impedance Monitoring with Modified Principal Component Analysis",
      "publisher": "Wiley / Plasma Processes and Polymers",
      "url": "https://doi.org/10.1002/ppap.201300030",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "RF impedance monitoring, small-area endpoint sensitivity, multivariate reduction, comparison to OES, and algorithm-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "patel-thermal-imaging-1991",
      "label": "Wafer temperature measurements and end-point detection during plasma etching by thermal imaging",
      "publisher": "AIP Publishing / Applied Physics Letters",
      "url": "https://doi.org/10.1063/1.105480",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Thermal-imaging endpoint response, wafer-temperature observation, thermal transient, spatial sensing, and heat-transfer-model-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "hong-oes-rga-fusion-2005",
      "label": "Neural-Network-Based Sensor Fusion of Optical Emission and Mass Spectroscopy Data for Real-Time Fault Detection in Reactive Ion Etching",
      "publisher": "IEEE / Transactions on Industrial Electronics",
      "url": "https://doi.org/10.1109/TIE.2005.851663",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "OES and mass-spectrometry sensor fusion, time-series features, real-time fault detection, cross-sensor evidence, and model-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "zakour-multivariate-endpoint-2017",
      "label": "Endpoint in plasma etch process using new modified w-multivariate charts and windowed regression",
      "publisher": "Springer / Journal of Industrial Engineering International",
      "url": "https://doi.org/10.1007/s40092-017-0186-x",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "OES profile monitoring, multivariate change detection, windowed regression, false endpoint, and statistical-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "kim-attention-lstm-endpoint-2024",
      "label": "Improved Plasma Etch Endpoint Detection Using Attention-Based Long Short-Term Memory Machine Learning",
      "publisher": "MDPI / Electronics",
      "url": "https://doi.org/10.3390/electronics13173577",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "Sequence-model endpoint detection, attention, temporal feature selection, robustness, and learned-model-boundary vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    },
    {
      "id": "kang-pecvd-multisensor-2018",
      "label": "An in situ monitoring method for PECVD process equipment condition",
      "publisher": "IOP Publishing / Plasma Science and Technology",
      "url": "https://doi.org/10.1088/2058-6272/aafb2b",
      "sourceType": "peer-reviewed-article-record",
      "rightsStatus": "link-only; publisher notices and terms apply",
      "numericUse": "none",
      "use": "PECVD deposition and chamber-clean monitoring with OES, optical plasma, and voltage-current sensors; multisensor context and equipment-condition vocabulary categories.",
      "artifactUse": "bibliographic metadata only; no body text, abstract wording, equation, coefficient, material, condition, geometry, method detail, result, figure, table, value, code, or model output copied"
    }
  ],
  "claims": [
    {
      "node_id": "EPS-C01",
      "claim": "Endpoint sensing is represented as process context, signal formation, transition observability, drift and calibration, false-endpoint exposure, cross-sensor fusion, measurement traceability, and downstream metrology handoff.",
      "source_ids": [
        "horiba-ev140c-oes",
        "horiba-lem-interferometry",
        "inficon-transpector-apx",
        "hong-oes-rga-fusion-2005"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C02",
      "claim": "OES, interferometry, RGA, pressure, RF, and temperature remain separate categorical sensor families with distinct signal paths and calibration ownership.",
      "source_ids": [
        "horiba-ev140c-oes",
        "horiba-lem-interferometry",
        "inficon-transpector-apx",
        "inficon-rf-sensing",
        "mks-baratron-etch",
        "horiba-infrared-thermometer"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C03",
      "claim": "OES signal formation depends on plasma emission, optical collection, spectral selection, background and noise, and viewport condition as separately owned evidence categories.",
      "source_ids": [
        "horiba-ev140c-oes",
        "zhang-ibe-oes-2022",
        "multiwavelength-oes-small-area-2001",
        "modified-gmm-oes-2020"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C04",
      "claim": "Interferometric endpoint evidence depends on illumination and collection geometry, reflected-light response, material stack, fringe or phase interpretation, and optical-model assumptions.",
      "source_ids": [
        "horiba-lem-interferometry",
        "layadi-interferometry-cmos-1999",
        "plasma-emission-interferometry-2015"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C05",
      "claim": "RGA evidence depends on sampling location and transport, inlet condition, ionization and fragmentation, mass-channel separation, background species, and process context.",
      "source_ids": [
        "inficon-transpector-apx",
        "clarke-mass-spectrometry-1985",
        "priebe-tofms-ald-2022"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C06",
      "claim": "Pressure sensing is process-context evidence rather than a direct endpoint truth; gauge zero, thermal state, contamination, transient response, and control-loop interaction require owned calibration.",
      "source_ids": [
        "mks-baratron-etch",
        "plasma-impedance-endpoint-2010",
        "jang-pim-mpca-2013"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C07",
      "claim": "RF voltage, current, phase, impedance, harmonic, reflected-power, and arc signatures are distinct electrical observations and do not share endpoint interpretation by label.",
      "source_ids": [
        "inficon-rf-sensing",
        "plasma-impedance-endpoint-2010",
        "jang-pim-mpca-2013"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C08",
      "claim": "Temperature sensing can expose process transitions and equipment condition, but emissivity, optical access, thermal lag, spatial response, and heat-transfer interpretation remain separate evidence scopes.",
      "source_ids": [
        "horiba-infrared-thermometer",
        "patel-thermal-imaging-1991",
        "kang-pecvd-multisensor-2018"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C09",
      "claim": "Sensor drift can arise from optical-window coating, source-path change, inlet contamination, gauge zero shift, thermal environment, RF coupling, and chamber state; each cause needs traceable evidence.",
      "source_ids": [
        "zhang-ibe-oes-2022",
        "inficon-transpector-apx",
        "mks-baratron-etch",
        "horiba-infrared-thermometer"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C10",
      "claim": "Low open area, weak transitions, overlapping species, cyclic signals, baseline motion, noise, and process-step changes can create ambiguous or false endpoints.",
      "source_ids": [
        "multiwavelength-oes-small-area-2001",
        "modified-gmm-oes-2020",
        "zakour-multivariate-endpoint-2017",
        "jang-pim-mpca-2013"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C11",
      "claim": "Sensor fusion requires synchronized lineage, modality-specific preprocessing, missing-sensor behavior, disagreement handling, drift review, and independently validated decision logic.",
      "source_ids": [
        "hong-oes-rga-fusion-2005",
        "kang-pecvd-multisensor-2018",
        "kim-attention-lstm-endpoint-2024"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C12",
      "claim": "Etch, deposition, and chamber-clean contexts remain distinct; a signal or model validated in one context is not transferred automatically to another.",
      "source_ids": [
        "horiba-ev140c-oes",
        "horiba-lem-interferometry",
        "priebe-tofms-ald-2022",
        "kang-pecvd-multisensor-2018"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C13",
      "claim": "CMP, etch, deposition, and plasma-state inputs are categorical upstream evidence only and are neither imported as physical values nor recalculated by this packet.",
      "source_ids": [
        "horiba-lem-interferometry",
        "inficon-transpector-apx",
        "plasma-impedance-endpoint-2010"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C14",
      "claim": "Every threshold, baseline, spectral channel, mass channel, optical model, electrical feature, temperature interpretation, fusion model, and stop decision requires owned calibration and validation.",
      "source_ids": [
        "mks-baratron-etch",
        "zhang-ibe-oes-2022",
        "hong-oes-rga-fusion-2005",
        "patel-thermal-imaging-1991"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C15",
      "claim": "Endpoint and equipment-state measurements require accountable calibration, uncertainty, synchronization, sampling, raw-data lineage, drift checks, false-endpoint review, and disposition ownership.",
      "source_ids": [
        "horiba-ev140c-oes",
        "inficon-rf-sensing",
        "zakour-multivariate-endpoint-2017",
        "kang-pecvd-multisensor-2018"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    },
    {
      "node_id": "EPS-C16",
      "claim": "A teaching-ready endpoint-sensor label never authorizes wavelength or mass-channel selection, threshold setting, process stop, equipment action, maintenance action, wafer disposition, qualification, or production release.",
      "source_ids": [
        "horiba-ev140c-oes",
        "inficon-transpector-apx",
        "inficon-rf-sensing",
        "mks-baratron-etch"
      ],
      "boundary": "Category-level provenance only; no source wording, abstract, numeric value, material, condition, geometry, method, result, equation, code, threshold, calibration value, or model output is imported."
    }
  ],
  "hardBoundary": "No source body, abstract, source numeric value, equation, coefficient, material, condition, geometry, method detail, result, figure, table, code, named-tool output, proprietary output, or live run is stored or used. Only link-level bibliographic metadata and category-level provenance are retained."
}
