# Lithography-To-Etch Feedforward Control Replay Model Card

Version: 2026-08-20-v78

## Purpose

This browser lab teaches why post-lithography measurement should be connected to downstream etch correction, CD distribution, Cpk-style evidence fitness, and electrical consequence. It is a public-safe teaching replay, not a process-control recipe.

## Dataset

- Rows: 1296
- Wafer zones: center, mid, edge
- Lithography CD bins: narrow, nominal, wide
- Overlay signatures: centered, x_shift, y_shift, rotation
- Resist states: thin, nominal, thick
- Feedforward actions: none, track_remeasure, etch_bias_offset, hold_for_review
- Focus buckets: low_focus, nominal_focus, high_focus

## Public Boundary

- No process recipe, gas ratio, scanner setting, etch setting, equipment-control instruction, interlock procedure, or rework procedure.
- No copied article body, SEMulator3D setup, commercial tool file, screenshot, plot, or vendor claim.
- No live server solver, uploaded wafer data, qualification gate, product release, foundry claim, or calibrated yield claim.

## Source Anchors

- Feedforward control for semiconductor manufacturing: https://semiengineering.com/dont-scrap-it-save-it-feedforward-control-for-modern-semiconductor-manufacturing/
- ASML measuring accuracy: https://www.asml.com/en/technology/lithography-principles/measuring-accuracy
- ASML lithography technology: https://www.asml.com/en/technology
- NIST CHIPS Metrology Program: https://www.nist.gov/chips/research-development-programs/metrology-program
- NIST metrology and process-control uncertainty: https://www.nist.gov/publications/metrology-and-process-control-dealing-measurement-uncertainty
- SemiAgora global platform scan v2: https://semiagora.com/research/reading-room