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    "sources": 20,
    "claimNodes": 16,
    "linkStatus": "pass",
    "reachable": 18,
    "accessGated": 2,
    "hardFailures": 0,
    "networkErrors": 0,
    "sourceBodiesStored": false,
    "sourceNumericUse": "none"
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    "changedByThisPacket": false,
    "publicVersionReserved": "none",
    "releaseDecision": "hold"
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  "publicDelivery": {
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    "rowArtifact": "lpcvd-furnace-state-v1.csv",
    "rowArtifactSha256": "FB62FF828CBAA4ABD6CF60CBA82CA772FDC207342280381B57AA55420EFD2ECC",
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    "sourceSpineArtifact": "lpcvd-furnace-source-spine-v1.json",
    "sourceSpineArtifactSha256": "166716B33D76F51D5EE34B019D32935DFF9AC3C03125E89115AB6263DDD81F7A",
    "publicHoldArtifact": "public-hold-verification-v1.json",
    "publicHoldArtifactSha256": "54CA0E2E612125EECAAE7695DB5F13A8BD00AE35558AD6D4060CBE16C24FDAF3"
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      "sha256": "65D849DF15B50394C96193BA1D629AD40AD8F064E378DD39C8EDDE4E708AE7A9"
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    "metrics": {
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      "sha256": "321058BC240524197B5E3B6D8075349FB0D3E98268D6F6D7AF64C1861765A758"
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    "verifier": {
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    "sourceCatalog": {
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    "claimMap": {
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  "furnaceRegimes": [
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    "reactant-delivery-starved",
    "surface-growth-limited",
    "longitudinal-depletion-limited",
    "thermal-uniformity-limited",
    "film-property-limited",
    "metrology-readiness-limited",
    "bounded-batch-furnace"
  ],
  "requiredPhenomena": [
    "process-family-hot-wall-and-load-context",
    "reactant-delivery-depletion-and-interwafer-access",
    "surface-growth-and-reaction-posture",
    "boat-position-load-end-and-center-context",
    "ramp-soak-thermal-history-and-uniformity",
    "thickness-within-wafer-and-wafer-to-wafer-variation",
    "stress-composition-interface-and-surface-readiness",
    "metrology-traceability-throughput-and-handoff"
  ],
  "upstreamBridges": [
    {
      "sourceExperimentId": "SA-EQP-VAC-GAS-009",
      "allowedFields": [
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        "upstream_vac_gas_stability_band",
        "upstream_vac_gas_evidence_gate"
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      "physicalUnitsAllowed": false,
      "automaticStateImportAllowed": false
    },
    {
      "sourceExperimentId": "SA-PROC-DEP-CVD-PECVD-013",
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        "upstream_cvd_pecvd_uniformity_band",
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      "physicalUnitsAllowed": false,
      "automaticStateImportAllowed": false
    },
    {
      "sourceExperimentId": "SA-PROC-DEP-ALD-PEALD-014",
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        "upstream_ald_evidence_gate"
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      "physicalUnitsAllowed": false,
      "automaticStateImportAllowed": false
    },
    {
      "sourceExperimentId": "SA-PROC-ETCH-WET-019",
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        "upstream_wet_residue_band",
        "upstream_wet_evidence_gate"
      ],
      "physicalUnitsAllowed": false,
      "automaticStateImportAllowed": false
    }
  ],
  "downstreamBridge": {
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      "downstream_thermal_history_band",
      "downstream_film_property_priority_band",
      "downstream_metrology_priority_band",
      "downstream_inspection_evidence_gate",
      "teaching_furnace_handoff_gate"
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    "physicalUnitsAllowed": false,
    "automaticRecipeHandoffAllowed": false,
    "automaticFilmHandoffAllowed": false,
    "automaticEquipmentActionAllowed": false,
    "automaticDispositionAllowed": false
  },
  "replacementEvidenceRequirements": [
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    "revisioned furnace, process tube, liner, boat, injector, exhaust, heater-zone, thermocouple, controller, and sequencing configuration",
    "owned substrate, incoming surface, target film or conversion layer, underlying layer, interface, and prior-process histories",
    "owned precursor, reactant, carrier, diluent, byproduct, wall-condition, contamination, and exhaust evidence appropriate to each claim",
    "owned process-family classification and material-specific growth or conversion evidence",
    "boat slot, wafer position, load size, spacing, dummy-wafer, baffle, load-end, and center-load ownership",
    "owned pressure, delivery, flow, residence, depletion, interwafer-access, pumping, and leak-state evidence",
    "owned furnace-wall, wafer, ramp, soak, cooldown, zone, and spatial thermal histories with calibrated sensors and traceability",
    "owned surface-reaction, gas-phase-reaction, nucleation, growth, oxidation, nitridation, and model-limit measurements with uncertainty",
    "owned thickness, within-wafer, wafer-to-wafer, load-end, load-center, lot-to-lot, and equipment-to-equipment variation evidence",
    "owned composition, stoichiometry, density, refractive-index, resistivity, and material-property measurements appropriate to the film",
    "owned stress, curvature, defect, particle, roughness, interface, contamination, and surface-readiness evidence",
    "owned endpoint or completion signal, algorithm, threshold, latency, stop action, and false-trigger review where applicable",
    "owned tube history, wall deposition, seasoning, clean, maintenance, consumable, leak-check, and matching evidence",
    "owned loading, unload, queue, cycle, utilization, throughput, and equipment-availability evidence",
    "owned metrology methods, sampling plan, calibration state, detection limits, uncertainty, and raw-data lineage",
    "explicit separation of furnace-wall state, controller state, wafer thermal state, and film-result evidence",
    "explicit validation of any physical oxidation, deposition, nitridation, thermal, transport, or stress model before use",
    "independent review of model boundary, proxy ownership, replacement completeness, and non-predictive teaching use",
    "downstream inspection approval and accountable integration, yield, reliability, and disposition review"
  ],
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    "Run Card",
    "Export",
    "Methods",
    "Limits",
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}
