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"physicalUnitsAllowed": false, "automaticStateImportAllowed": false, "evidencePostureOnly": true }, { "sourceExperimentId": "SA-PROC-MASK-RETICLE-035", "allowedFields": [ "downstream_substrate_wafering_readiness_band", "downstream_placement_priority_band", "downstream_cd_priority_band", "downstream_printability_priority_band", "downstream_metrology_evidence_gate", "teaching_mask_reticle_handoff_gate" ], "physicalUnitsAllowed": false, "automaticStateImportAllowed": false, "evidencePostureOnly": true } ], "downstreamBridge": { "targetExperimentId": "SA-EQP-SUSTAINABILITY-041", "allowedOutputFields": [ "downstream_sustainability_readiness_band", "downstream_placement_stability_priority_band", "downstream_warpage_priority_band", "downstream_mold_material_priority_band", "downstream_resource_accounting_priority_band", "downstream_model_limit_priority_band", "downstream_panel_evidence_gate", "downstream_sustainability_evidence_gate", "teaching_panel_packaging_handoff_gate" ], "physicalUnitsAllowed": false, "automaticActionAllowed": false, "automaticStateTransferAllowed": false, "status": "blocked-until-owned-sustainability-replacement-evidence" }, "replacementEvidenceRequirements": [ "Accountable panel, carrier, lot, die, product, route, equipment, material, and process-program identity with approved ownership and revision history.", "Revisioned chip-first or RDL-first architecture, panel family, carrier stack, die layout, RDL stack, mask set, molding flow, plating flow, and change record.", "Owned panel dimensions, flatness, bow, warpage, support, restraint, carrier, handling, load-port, and transfer evidence with uncertainty.", "Owned die placement coordinates, alignment, registration, die-shift measurements, map reconciliation, and spatial uncertainty.", "Owned encapsulation material identity, lot, CTE, modulus, viscosity, cure, shrinkage, flow, fill, void, and traceability evidence.", "Owned warpage, bow, stress, strain, panel-shape, material-property, thermal-history, and model-validation evidence.", "Owned RDL layer stack, seed/barrier, dielectric, via, line/space, adhesion, continuity, resistance, and inspection evidence.", "Owned lithography tool, mask, dose, focus, overlay, registration, distortion, outlier-control, and process-window evidence.", "Owned plating bath, chemistry, current distribution, agitation, seed continuity, thickness, uniformity, roughness, defect, and metrology evidence.", "Owned substrate and yield maps, panel orientation, die coordinates, row identity, genealogy, data lineage, and traceability reconciliation.", "Owned singulation route, kerf, chipping, debris, die strength, contamination, inspection, and package-level handoff evidence.", "Owned equipment state, calibration, maintenance, alarm, drift, fault signature, environmental, and data-collection records aligned to the replay interval.", "Owned defect taxonomy, yield accounting, rework, scrap, escape, sampling, and independent validation evidence for the intended product.", "Owned sustainability inputs for energy, water, gases, chemicals, consumables, abatement, waste, utilization, and uncertainty before downstream accounting.", "Approved acceptance criteria, qualification protocol, reliability review, control plan, rollback criteria, product limits, and production-release authority.", "Approved panel-process, RDL/lithography, molding/plating, packaging-metrology, equipment, quality, EHS, sustainability, and accountable human sign-off." ], "requiredSections": [ "Explore", "Run Card", "Export", "Methods", "Limits", "Evidence" ], "limitation": "Original dimensionless fan-out and panel-level packaging evidence teaching replay only. No physical panel characteristic, placement or die-shift value, warpage value, material property, lithography or overlay result, molding or plating result, singulation result, yield value, sustainability quantity, equipment action, qualification, disposition, production fitness, or release decision is computed or implied." }