# Front-End and Pattern-Transfer Process Model Card

SemiAgora process simulations in this packet are educational replays. They teach process vocabulary, evidence structure, and model boundaries before any facility recipe appears.

## Included Simulations

- `SA-PROC-FEOL-OXDIFF-001`: thermal oxidation thickness, silicon consumption, and diffusion broadening.
- `SA-PROC-FEOL-LITHO-WINDOW-001`: photolithography dose/focus window and CD-error pass mask.
- `SA-PROC-FEOL-ETCH-PROFILE-001`: etch selectivity, sidewall profile, mask budget, and CD loss.
- `SA-PROC-BEOL-CMP-PLANAR-001`: Preston-style CMP removal, pattern-density warnings, and wafer-level nonuniformity.
- `SA-PROC-FEOL-IMPLANT-ANNEAL-001`: implant projected range, straggle, activation, and anneal broadening.
- `process_front_end_models.py`: compact reference script for the public teaching equations.

## Public Boundary

These files do not contain qualified recipes, equipment settings, chamber histories, tool passwords, facility procedures, PDK content, NDA material, or production metrology. They should not be used to process wafers.

## Source Spine

- MIT OCW 6.152J Micro/Nano Processing Technology: https://ocw.mit.edu/courses/6-152j-micro-nano-processing-technology-fall-2005/
- MIT OCW 6.152J lecture notes: https://ocw.mit.edu/courses/6-152j-micro-nano-processing-technology-fall-2005/pages/lecture-notes/
- MIT OCW 6.774 readings: https://ocw.mit.edu/courses/6-774-physics-of-microfabrication-front-end-processing-fall-2004/pages/readings/
- MIT OCW 6.152J dry etching lecture: https://ocw.mit.edu/courses/6-152j-micro-nano-processing-technology-fall-2005/59b9f31d836355a3380aa156925508bc_lecture17.pdf
- MIT CMP erosion model paper: https://web.mit.edu/cmp/publications/papers/noh_final.pdf
- MIT OCW semiconductor process variation lecture: https://ocw.mit.edu/courses/2-830j-control-of-manufacturing-processes-sma-6303-spring-2008/resources/2-semiconductor-process-variation/

## Recommended Next Data

The next useful materials are rights-clean metrology summaries: ellipsometry, profilometry, CD-SEM, cross-section SEM, SIMS, sheet resistance, blanket CMP rates, endpoint traces, and clearly documented uncertainty. Recipe details can stay private while evidence quality improves.