{
  "schema": "semiagora.process-simulation.v1",
  "experiment_id": "SA-PROC-THERM-DAMAGE-RECOVERY-001",
  "title": "Implant damage recovery and TED",
  "execution_mode": "precomputed-only",
  "model_boundary": "Educational post-implant recovery replay with normalized anneal time; not a calibrated defect or diffusion model.",
  "samples": [
    {
      "normalized_anneal_time": 0,
      "defect_remaining_percent": 100.0,
      "activated_fraction_percent": 0.0,
      "ted_tail_proxy_nm": 5.0,
      "review_note": "Damage repair, activation, and TED tail growth must be reviewed together."
    },
    {
      "normalized_anneal_time": 1,
      "defect_remaining_percent": 88.9,
      "activated_fraction_percent": 13.82,
      "ted_tail_proxy_nm": 6.51,
      "review_note": "Damage repair, activation, and TED tail growth must be reviewed together."
    },
    {
      "normalized_anneal_time": 2,
      "defect_remaining_percent": 79.03,
      "activated_fraction_percent": 25.51,
      "ted_tail_proxy_nm": 7.94,
      "review_note": "Damage repair, activation, and TED tail growth must be reviewed together."
    },
    {
      "normalized_anneal_time": 5,
      "defect_remaining_percent": 55.53,
      "activated_fraction_percent": 50.89,
      "ted_tail_proxy_nm": 11.79,
      "review_note": "Damage repair, activation, and TED tail growth must be reviewed together."
    },
    {
      "normalized_anneal_time": 10,
      "defect_remaining_percent": 30.84,
      "activated_fraction_percent": 73.0,
      "ted_tail_proxy_nm": 16.93,
      "review_note": "Damage repair, activation, and TED tail growth must be reviewed together."
    },
    {
      "normalized_anneal_time": 20,
      "defect_remaining_percent": 9.51,
      "activated_fraction_percent": 86.79,
      "ted_tail_proxy_nm": 23.78,
      "review_note": "Damage repair, activation, and TED tail growth must be reviewed together."
    },
    {
      "normalized_anneal_time": 40,
      "defect_remaining_percent": 0.9,
      "activated_fraction_percent": 89.89,
      "ted_tail_proxy_nm": 29.97,
      "review_note": "Damage repair, activation, and TED tail growth must be reviewed together."
    }
  ],
  "derived_metrics": {
    "half_damage_recovery_time_index": 6.0,
    "activation_at_time_10_percent": 73.0,
    "ted_tail_at_time_40_nm": 29.97
  },
  "verification": {
    "sample_count": 7,
    "defects_decrease": true,
    "activation_increases": true,
    "ted_tail_increases": true,
    "all_cases_precomputed": true
  },
  "limitations": [
    "No furnace recipe, RTA program, laser scan condition, gas ambient, wafer handling, ramp-rate setpoint, endpoint, or tool-control instruction is provided.",
    "All axes are normalized teaching axes or simplified time-temperature profiles and must not be copied into equipment settings.",
    "The values are synthetic teaching replays, not measured SemiAgora wafer data, qualified metrology, or process release limits.",
    "Real anneal work requires material stack review, contamination controls, calibrated temperature metrology, electrical metrology, safety approval, and tool-specific training.",
    "Point-defect clustering, dopant species, channeling, amorphization, surface recombination, and material-specific calibration are not modeled."
  ],
  "sources": [
    {
      "label": "MIT OCW 6.152J ion implantation lecture",
      "url": "https://ocw.mit.edu/courses/6-152j-micro-nano-processing-technology-fall-2005/resources/lecture6/",
      "note": "Public lecture-note page anchoring diffusion, ion implantation, projected range, and implantation damage vocabulary."
    },
    {
      "label": "MIT OCW 6.774 transient enhanced diffusion",
      "url": "https://ocw.mit.edu/courses/6-774-physics-of-microfabrication-front-end-processing-fall-2004/resources/mit6_774f04_lec15_mp4/",
      "note": "Public lecture page for TED simulation examples and post-implant diffusion context."
    },
    {
      "label": "Optimal control of rapid thermal annealing",
      "url": "https://web.mit.edu/braatzgroup/70_Optimal_control_of_rapid_thermal_annealing_in_a_semiconductor_process.pdf",
      "note": "Open PDF discussing RTA, ultrashallow junctions, TED, sheet-resistance tradeoffs, and temperature trajectory control."
    }
  ]
}