# Process Metrology and DOE Model Card

SemiAgora process-metrology simulations in this packet are educational replays. They teach how a research-facing process claim should carry measurement method, uncertainty hints, extraction rules, limits, and source anchors before anyone treats a number as reusable evidence.

## Included Simulations

- `SA-PROC-METRO-ELLIPSOMETRY-001`: thin-film ellipsometry thickness fitting and residual inspection.
- `SA-PROC-METRO-4PP-SHEETR-001`: four-point probe sheet-resistance wafer map and nonuniformity.
- `SA-PROC-METRO-TLM-CONTACT-001`: transfer-length-method contact-resistance extraction.
- `SA-PROC-METRO-CDSEM-OVERLAY-001`: CD-SEM site map and overlay-vector control replay.
- `SA-PROC-METRO-SPC-CAPABILITY-001`: SPC sample set with Cp and Cpk capability calculations.
- `SA-PROC-METRO-DOE-RSM-001`: design-of-experiments response-surface replay for process-window thinking.
- `process_metrology_models.py`: compact reference script for the public teaching calculations.

## Public Boundary

These files do not contain qualified recipes, equipment settings, chamber histories, tool passwords, facility procedures, PDK content, NDA material, private wafer data, or production metrology. They should not be used to process wafers, release wafers, tune equipment, qualify a process, or claim measured SemiAgora silicon.

## Source Spine

- NIST Thin Film Reference Geometry Test Materials: https://www.nist.gov/programs-projects/thin-film-rgtms
- NIST dimensional metrology for nanoscale patterns: https://www.nist.gov/programs-projects/dimensional-metrology-nanoscale-patterns
- NIST Nanofab 280DI sheet-resistance mapping system: https://www.nist.gov/laboratories/tools-instruments/nanofab-tool-four-dimensions-280di-sheet-resistance-mapping-system
- BYU Cleanroom contact resistance and TLM: https://cleanroom.byu.edu/contact_resistance
- NIST/SEMATECH Engineering Statistics Handbook chapter 6: https://www.nist.gov/publications/nistsematech-engineering-statistics-handbook-chapter-6-process-or-product-monitoring
- NIST process capability: https://www.itl.nist.gov/div898/handbook/pmc/section1/pmc16.htm
- NIST/SEMATECH experimental design selection: https://www.itl.nist.gov/div898/handbook/pri/section3/pri33.htm

## Recommended Next Data

The next useful materials are rights-clean metrology summaries: ellipsometry or XRR thickness maps, four-point probe maps, TLM I-V sweeps, CD-SEM sampling plans, overlay vectors, SPC time order, DOE run orders, uncertainty budgets, and source-rights notes. Recipe details can stay private while evidence quality improves.