{
  "schema": "semiagora.process-simulation.v1",
  "experiment_id": "SA-PROC-THERM-BUDGET-COMPARE-001",
  "title": "Spike versus furnace thermal budget",
  "execution_mode": "precomputed-only",
  "model_boundary": "Educational comparison of normalized anneal modes; not an equipment program or process recommendation.",
  "cases": [
    {
      "id": "furnace_soak",
      "label": "Furnace soak teaching mode",
      "relative_peak_temperature": "moderate",
      "relative_duration": "long",
      "activation_score": 0.88,
      "diffusion_broadening_nm": 28.5,
      "uniformity_score": 0.92,
      "temperature_control_risk": 0.18,
      "thermal_budget_index": 1.0,
      "shallow_junction_score": 0.3,
      "paper_review_warning": "Ask for temperature metrology, spatial uniformity, and electrical activation evidence before comparing anneal modes."
    },
    {
      "id": "spike_rta",
      "label": "Spike RTA teaching mode",
      "relative_peak_temperature": "high",
      "relative_duration": "short",
      "activation_score": 0.84,
      "diffusion_broadening_nm": 10.4,
      "uniformity_score": 0.78,
      "temperature_control_risk": 0.42,
      "thermal_budget_index": 0.36,
      "shallow_junction_score": 0.54,
      "paper_review_warning": "Ask for temperature metrology, spatial uniformity, and electrical activation evidence before comparing anneal modes."
    },
    {
      "id": "millisecond_anneal",
      "label": "Millisecond anneal teaching mode",
      "relative_peak_temperature": "very high local",
      "relative_duration": "very short",
      "activation_score": 0.74,
      "diffusion_broadening_nm": 3.2,
      "uniformity_score": 0.66,
      "temperature_control_risk": 0.71,
      "thermal_budget_index": 0.11,
      "shallow_junction_score": 0.79,
      "paper_review_warning": "Ask for temperature metrology, spatial uniformity, and electrical activation evidence before comparing anneal modes."
    }
  ],
  "derived_metrics": {
    "lowest_diffusion_case": "millisecond_anneal",
    "highest_uniformity_case": "furnace_soak",
    "balanced_public_teaching_case": "spike_rta"
  },
  "verification": {
    "case_count": 3,
    "diffusion_decreases_with_shorter_duration": true,
    "temperature_control_risk_increases_with_aggressive_mode": true,
    "all_cases_precomputed": true
  },
  "limitations": [
    "No furnace recipe, RTA program, laser scan condition, gas ambient, wafer handling, ramp-rate setpoint, endpoint, or tool-control instruction is provided.",
    "All axes are normalized teaching axes or simplified time-temperature profiles and must not be copied into equipment settings.",
    "The values are synthetic teaching replays, not measured SemiAgora wafer data, qualified metrology, or process release limits.",
    "Real anneal work requires material stack review, contamination controls, calibrated temperature metrology, electrical metrology, safety approval, and tool-specific training."
  ],
  "sources": [
    {
      "label": "Optimal control of rapid thermal annealing",
      "url": "https://web.mit.edu/braatzgroup/70_Optimal_control_of_rapid_thermal_annealing_in_a_semiconductor_process.pdf",
      "note": "Open PDF discussing RTA, ultrashallow junctions, TED, sheet-resistance tradeoffs, and temperature trajectory control."
    },
    {
      "label": "COMSOL Rapid Thermal Annealing model",
      "url": "https://www.comsol.com/model/rapid-thermal-annealing-504",
      "note": "Public model page describing RTA as dopant activation and metal-contact interfacial reaction with transient heat transfer."
    },
    {
      "label": "NIST laser annealed arsenic ultrashallow junctions",
      "url": "https://www.nist.gov/publications/deactivation-sub-melt-laser-annealed-arsenic-ultra-shallow-junctions-silicon-during",
      "note": "Public NIST publication page for laser anneal, activation/deactivation, Hall, EXAFS, and SIMS context."
    },
    {
      "label": "NIST Semiconductor Electronics Division facility summary",
      "url": "https://nvlpubs.nist.gov/nistpubs/Legacy/IR/nistir6430.pdf",
      "note": "Public NIST report listing microfabrication facility capabilities including furnaces, thermal oxidation, CVD, and annealing."
    }
  ]
}