{
  "schema": "semiagora.strip-ash-public-manifest.v1",
  "version": "2026-08-29-packet-v1",
  "packetVersion": "2026-08-29-strip-ash-v1",
  "experimentId": "SA-PROC-ETCH-STRIP-ASH-018",
  "generatedAt": "2026-08-29T00:00:00+09:00",
  "status": "packet-only-not-deployed",
  "counts": {
    "rows": 6912,
    "physicalRows": 3456,
    "evidencePairs": 3456,
    "evidencePairComparisons": 656640,
    "columns": 192,
    "sources": 20,
    "claimNodes": 16,
    "normalizedProxyEquations": 20,
    "exactIntegerLedgerEquations": 16,
    "exactIntegerLedgers": 3,
    "prohibitedZeroFields": 112
  },
  "axes": [
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      "id": "application_family",
      "count": 4,
      "values": [
        "front_end_implant_like",
        "interconnect_low_k_like",
        "contact_via_post_etch_like",
        "mems_surface_like"
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      "meaning": "Teaching integration archetypes without customer, device design, material identity, feature dimension, tool, recipe, or qualification."
    },
    {
      "id": "strip_mode",
      "count": 3,
      "values": [
        "direct_plasma_ash_like",
        "remote_downstream_strip_like",
        "staged_dry_clean_like"
      ],
      "meaning": "Bounded process-mode taxonomy only; no named chemistry, source design, sequence, temperature, product, or equipment command."
    },
    {
      "id": "resist_condition_state",
      "count": 3,
      "values": [
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        "bulk_resist_like",
        "crosslinked_hardened_like"
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      "meaning": "Original categorical resist-state context; not implant condition, material composition, thickness, chemistry, removal rate, or treatment instruction."
    },
    {
      "id": "residue_access_state",
      "count": 3,
      "values": [
        "residue_restricted_like",
        "residue_nominal_like",
        "residue_open_like"
      ],
      "meaning": "Original categorical residue-access and byproduct-clearance context; not feature geometry, flux, conductance, residue composition, or mass-transfer calculation."
    },
    {
      "id": "material_sensitivity_state",
      "count": 2,
      "values": [
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        "bounded_tolerance_like"
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      "meaning": "Original categorical review state; not a material identity, damage depth, loss rate, selectivity, qualification, or compatibility result."
    },
    {
      "id": "endpoint_posture_state",
      "count": 2,
      "values": [
        "endpoint_observed_like",
        "endpoint_unresolved_like"
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      "meaning": "Original categorical endpoint-evidence posture; not a signal, wavelength, threshold, process time, endpoint algorithm, or stop action."
    },
    {
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        "A01",
        "A02",
        "A03",
        "A04",
        "A05",
        "A06",
        "A07"
      ],
      "meaning": "Eight ordered review states for deterministic branch coverage; explicitly not time, dose, removal progress, thickness, endpoint, chamber state, or equipment state."
    },
    {
      "id": "evidence_posture",
      "count": 2,
      "values": [
        "teaching_assumption",
        "replacement_slot"
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      "meaning": "Metadata only. It is outside the physical key and cannot change any coefficient, proxy, token, regime, gate, bridge, or label."
    }
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      "strip_ash_regime": "bounded-strip-ash",
      "ordered_state_norm": 0,
      "reactive_delivery_stability_proxy": 0.6692,
      "crust_opening_readiness_proxy": 0.7988,
      "bulk_resist_access_proxy": 0.7248,
      "surface_reaction_control_proxy": 0.53,
      "removal_selectivity_proxy": 0.708952,
      "residue_access_proxy": 0.6204,
      "strip_progress_proxy": 0.533056,
      "loading_nonuniformity_burden_proxy": 0.4152,
      "residue_release_control_proxy": 0.580072,
      "surface_cleanliness_proxy": 0.6429496,
      "endpoint_uncertainty_burden_proxy": 0.291472,
      "overstrip_damage_burden_proxy": 0.35812,
      "material_margin_proxy": 0.5416,
      "substrate_loss_burden_proxy": 0.606208,
      "endpoint_confidence_proxy": 0.680952576,
      "post_strip_surface_readiness_proxy": 0.669548,
      "chamber_drift_burden_proxy": 0.47778496,
      "metrology_readiness_proxy": 0.615370515,
      "throughput_readiness_proxy": 0.729456,
      "operator_gate": "review-stability",
      "process_engineer_gate": "bounded-comparison-ready",
      "integration_gate": "strip-ash-handoff-blocked",
      "yield_gate": "bounded-teaching-review",
      "downstream_metrology_priority_band": "material-loss"
    }
  ],
  "sourceSummary": {
    "sources": 20,
    "claimNodes": 16,
    "linkStatus": "pass",
    "reachable": 13,
    "accessGated": 7,
    "hardFailures": 0,
    "networkErrors": 0,
    "sourceBodiesStored": false,
    "sourceNumericUse": "none"
  },
  "currentPublicBaseline": {
    "version": "v109",
    "versionId": "appgprj_6a6f4d3affc0819189d99a8f29062540~appgver_005d791cd0f881919fe28dce4fc90e8f",
    "deploymentId": "appgdep_6a91677cd40081919caf523a472130f6",
    "sourceCommit": "c3888cc26eb434d9ca88e76889f781194044db4a",
    "changedByThisPacket": false,
    "publicVersionReserved": "none",
    "releaseDecision": "hold"
  },
  "publicDelivery": {
    "mode": "metadata-manifest-plus-csv-rows",
    "rowsEmbedded": false,
    "rowArtifact": "strip-ash-state-v1.csv",
    "rowArtifactSha256": "C2C26A0D25A25C651F1DD7E6EE0D99883DC463A44A909628FE94E647D972306D",
    "canonicalRowBearingArtifact": "strip-ash-state-web-v1.json",
    "canonicalRowBearingArtifactSha256": "5BA1897888B321C6C55D4226E607355A3EC96FEDE7FD30FBF30E07793A89B4E2",
    "independentValidationArtifact": "validation-report-v1.json",
    "independentValidationArtifactSha256": "F8F800B57A28D97C8962A62D7FC50996CD2A140B90786E9403F3EC280B280149",
    "sourceSpineArtifact": "strip-ash-source-spine-v1.json",
    "sourceSpineArtifactSha256": "2576258A08C6CCB28A9AF5B26D072C05D6B8C3CF3E5DA67DD2DDCB25FB6E1580",
    "publicHoldArtifact": "public-hold-verification-v1.json",
    "publicHoldArtifactSha256": "24339A288506E0B20DE21A7B441E2CC11F8DB75F0D9E9C999FDD1C8CE4994EB0"
  },
  "contracts": {
    "state": {
      "file": "strip-ash-state-contract-v1.json",
      "sha256": "11BAA77EE1D2B27A74EE1314AD5659F73144F924780CA79EF0A517C96EC56F1B"
    },
    "metrics": {
      "file": "strip-ash-metric-contract-v1.json",
      "sha256": "1859CDB506E63C3D995F2D65774E425BBCBF4AA448CFEA0EE14019FAFB08398D"
    },
    "verifier": {
      "file": "independent-verifier-contract-v1.json",
      "sha256": "3C4CB1F9C76B7716906611BFFF0ADDC4FDAA13E6E842C4E3BE8B229DE5E1A5A3"
    },
    "sourceCatalog": {
      "file": "source_catalog_v1.json",
      "sha256": "A198270887386588781CCAB6B6831C5096A8CDDB4630B228BEF5FB24030605EF"
    },
    "claimMap": {
      "file": "source_claim_map_v1.json",
      "sha256": "6C83B2D6E0862ECB96BEBBD2F4B4D470C8060CD90A2D667CF6EDA104C962CF6D"
    }
  },
  "stripAshRegimes": [
    "removal-delivery-starved",
    "implanted-crust-limited",
    "crosslinked-resist-limited",
    "residue-byproduct-limited",
    "material-damage-limited",
    "endpoint-unresolved",
    "surface-readiness-limited",
    "bounded-strip-ash"
  ],
  "requiredPhenomena": [
    "process-mode-and-reactive-delivery",
    "implanted-crust-and-bulk-removal",
    "crosslinked-resist-access",
    "post-etch-and-post-ash-residue",
    "material-damage-and-substrate-loss",
    "endpoint-and-overstrip-control",
    "uniformity-drift-and-byproduct-clearance",
    "metrology-throughput-and-post-clean-handoff"
  ],
  "upstreamBridges": [
    {
      "sourceExperimentId": "SA-EQP-VAC-GAS-009",
      "allowedFields": [
        "upstream_vac_delivery_band",
        "upstream_vac_exhaust_band",
        "upstream_vac_evidence_gate"
      ],
      "physicalUnitsAllowed": false,
      "automaticStateImportAllowed": false
    },
    {
      "sourceExperimentId": "SA-EQP-PLASMA-CCP-ICP-008",
      "allowedFields": [
        "upstream_plasma_neutrality_band",
        "upstream_plasma_direct_exposure_burden_band",
        "upstream_plasma_evidence_gate"
      ],
      "physicalUnitsAllowed": false,
      "automaticStateImportAllowed": false
    },
    {
      "sourceExperimentId": "SA-PROC-ETCH-RIE-010",
      "allowedFields": [
        "upstream_rie_residue_band",
        "upstream_rie_surface_state_band",
        "upstream_rie_evidence_gate"
      ],
      "physicalUnitsAllowed": false,
      "automaticStateImportAllowed": false
    },
    {
      "sourceExperimentId": "SA-PROC-ETCH-DRIE-017",
      "allowedFields": [
        "upstream_drie_residue_band",
        "upstream_drie_profile_state_band",
        "upstream_drie_evidence_gate"
      ],
      "physicalUnitsAllowed": false,
      "automaticStateImportAllowed": false
    }
  ],
  "downstreamBridge": {
    "targetExperimentId": "SA-MET-INSPECTION-030",
    "allowedFields": [
      "downstream_surface_cleanliness_band",
      "downstream_damage_review_band",
      "downstream_residue_priority_band",
      "downstream_metrology_priority_band",
      "downstream_inspection_evidence_gate",
      "teaching_strip_ash_handoff_gate"
    ],
    "physicalUnitsAllowed": false,
    "automaticRecipeHandoffAllowed": false,
    "automaticGeometryHandoffAllowed": false,
    "automaticEquipmentActionAllowed": false,
    "automaticDispositionAllowed": false
  },
  "replacementEvidenceRequirements": [
    "accountable run identifier, wafer ownership, review owner, endpoint owner, post-clean owner, and disposition owner",
    "revisioned chamber, plasma source, substrate electrode, remote source, thermal stage, load-lock, exhaust, abatement, and sequencing configuration",
    "owned substrate, resist, hard mask, dielectric, conductor, stop layer, barrier, interface, and neighboring-material identities with preparation and change histories",
    "owned reactive species, carrier, diluent, byproduct, residue, contamination, and surface-termination evidence appropriate to each claim",
    "resist history, exposure, bake, etch, implant, crosslink, carbonization, hardening, storage, and pre-strip evidence",
    "source power, coupling, match, bias, ion, neutral, electron, photon, charging, and source-to-wafer exposure evidence with uncertainty",
    "pressure, pumping, throttle, conductance, chamber volume, residence, exhaust, wall state, conditioning, and chamber-history evidence",
    "substrate temperature, spatial temperature map, thermal contact, backside condition, ramp, repeatability, and calibration evidence",
    "revisioned pattern opening, open area, pattern density, layout neighborhood, wafer position, and sampling geometry",
    "remaining resist thickness, crust state, sidewall residue, via residue, field residue, post-ash residue, and across-wafer evidence",
    "removal rate, removal uniformity, loading, endpoint trace, overstrip, understrip, process duration, and uncertainty evidence",
    "low-k, ultralow-k, oxide, nitride, silicon, metal, barrier, liner, contact, and interface compatibility evidence",
    "carbon depletion, oxidation, hydrogen loss, substrate loss, surface modification, charging, photon exposure, and damage evidence",
    "surface, via, contact, sidewall, opening, center, edge, exclusion-zone, and wafer-map measurements with uncertainty",
    "XPS, FTIR, ellipsometry, SEM, optical-emission, electrical, contact, defect, and contamination evidence appropriate to each claim",
    "dry-strip to wet-clean sequence, transfer delay, ambient exposure, queue, rinse, dry, recontamination, and post-clean ownership evidence",
    "time-order, wafer-to-wafer, chamber-to-chamber, maintenance, wall-state, resist-lot, material-lot, and drift evidence",
    "throughput, availability, process duration, queueing, utilization, abatement, consumable, and ownership evidence",
    "measurement-system analysis, calibration records, uncertainty budget, sampling plan, detection limits, and gauge capability",
    "model version, assumptions, parameters, applicability limits, independent review, rights review, safety review, and accountable approval"
  ],
  "requiredSections": [
    "Explore",
    "Run Card",
    "Export",
    "Methods",
    "Limits",
    "Evidence"
  ],
  "limitation": "Original dimensionless strip/ash teaching replay only. No physical chemistry, sequence, temperature, plasma species, resist condition, residue composition, removal rate, film thickness, material loss, low-k damage, endpoint trace, across-wafer uniformity, chamber behavior, equipment capability, recipe, qualification, reliability, or production fitness is computed or implied."
}
