{ "schema": "semiagora.thinning-dicing-public-manifest.v1", "version": "2026-08-30-thinning-dicing-packet-v1", "packetVersion": "2026-08-30-thinning-dicing-v1", "experimentId": "SA-PKG-THIN-DICE-038", "generatedAt": "2026-08-30T00:00:00+09:00", "status": "packet-only-not-deployed", "counts": { "rows": 5760, "physicalRows": 2880, "evidencePairs": 2880, "evidencePairComparisons": 547200, "columns": 192, "sources": 20, "claimNodes": 16, "normalizedProxyEquations": 20, "exactIntegerLedgerEquations": 16, "exactIntegerLedgers": 3, "prohibitedZeroFields": 112 }, "axes": [ { "id": "thinning_dicing_family", "count": 5, "values": [ "backgrind-like", "stress-relief-like", "laser-dicing-like", "plasma-dicing-like", "mechanical-dicing-like" ], "meaning": "Categorical thinning or dicing family only; not a supplier, material stack, tool, wheel, blade, laser, plasma, geometry, recipe, qualification, or production route." }, { "id": "support_warpage_state", "count": 2, "values": [ 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tape, thinning-tool, singulation-tool, metrology, reliability, test, lot, die, and disposition ownership", "revisioned material stack, process traveler, thinning route, dicing route, recipe, inspection flow, test flow, qualification flow, and change control", "owned backgrind, stress-relief, laser-dicing, plasma-dicing, and mechanical-dicing applicability evidence", "owned temporary support, carrier, adhesive, tape, chuck, handling, release, and debond evidence", "owned initial and final thickness, total-thickness-variation, bow, warp, sori, flatness, support, and gravity-correction evidence", "owned grinding wheel, grit, force, speed, feed, removal, coolant, subsurface-damage, residual-stress, and crack evidence", "owned wet, dry, plasma, polish, chemical, thermal, and mechanical stress-relief evidence", "owned blade, spindle, feed, force, cooling, wear, exposure, kerf, chipping, crack, debris, and sidewall evidence", "owned laser wavelength, pulse, fluence, power, scan, focus, ablation, stealth-modification, recast, heat-affected-zone, and sidewall evidence", "owned plasma species, source, bias, pressure, flow, mask, etch, sidewall, residue, selectivity, and endpoint evidence", "owned die-strength method, specimen orientation, support span, loading side, force, stress, distribution, uncertainty, and failure evidence", "owned particle, debris, slurry, residue, fluoropolymer, contamination, clean, inspection, and retention evidence", "owned metrology tool, calibration, traceability, sampling, uncertainty, detection, nuisance, map registration, and data-retention evidence", "approved thinning engineering, singulation engineering, packaging metrology, die reliability, probe/test, EHS, and change-control review", "accountable evidence owner, revision, timestamp, retention, qualification, release, hold, escalation, and disposition boundary", "owned source rights, citation link, bibliographic metadata, applicability, access status, and evidence-boundary records" ], 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No physical thinning or dicing recipe, support setting, damage or stress-relief result, kerf or chipping limit, die-strength result, contamination criterion, sampling plan, probe/test action, equipment action, qualification, disposition, or production fitness is computed or implied." }