63.168Best planarization scoreUNKNOWNInspect metric contract
55.524 nmWorst residual topographyUNKNOWNInspect metric contract
54 casesSweep rowsUNKNOWNInspect metric contract
SIMULATION / SA-PROC-CMP-001
CMP pattern-density dishing and erosion replay
CMP Dishing
Replay pattern density, feature width, overpolish proxy, and pad age to connect layout density with dishing, erosion, nonuniformity, and planarization evidence.
EXPLORE
Start with the observable.
Use this page when the simulation is the primary artifact. The linked lesson explains the concept; the linked lab keeps the visual replay surface available.
- Connect layout density to wafer topography before treating CMP as a blanket removal rate.
- Read dishing and erosion separately because they describe different geometry failures.
- Use dummy-fill and metrology vocabulary without exposing slurry, pad, or endpoint recipes.
RUN CARD
Conditions before conclusions.
This page replays saved CMP Dishing rows and does not run a live solver, upload workflow, proprietary model, process recipe, or signoff flow.
Primary knobs
- Pattern density
- Feature width
- Overpolish proxy
- Pad age
Saved outputs
- Dishing
- erosion
- residual topography
- removal nonuniformity
- planarization score
EXPORT
Download the public artifacts.
These exports are the supported public files for review. PDK files and restricted third-party material are not redistributed.
Dataset JSON
/data/cmp-pattern-density-dishing-erosion-web-v1.json
Open file ->Dataset CSV
/data/cmp-pattern-density-dishing-erosion-v69.csv
Open file ->v69 knowledge sprint summary CSV
/data/v69-knowledge-sim-sprint-summary.csv
Open file ->v69 knowledge sprint model script
/data/v69_knowledge_sim_sprint.mjs
Open file ->v69 knowledge sprint model card
/data/v69-knowledge-sim-sprint-model-card.md
Open file ->METHODS
How the number was made.
Methods are written for citation discipline: the extraction rule matters as much as the plotted value.
Dishing proxy increases with feature width, overpolish, pad factor, and low-density exposure.
Keep this method attached when reusing the figure or metric.
Erosion proxy increases with dense pattern area and overpolish pressure.
Keep this method attached when reusing the figure or metric.
Planarization score combines residual topography and removal nonuniformity penalties.
Keep this method attached when reusing the figure or metric.
LIMITS
What this page does not claim.
The MVP is useful because the limits are visible. These statements prevent a teaching simulation from being cited as silicon evidence.
No slurry chemistry, pad conditioning, pressure map, endpoint sensor, material stack, or recipe setting is modeled.
Carry this boundary into any derivative note, paper draft, or slide.
Pattern density is normalized and not tied to a product layout.
Carry this boundary into any derivative note, paper draft, or slide.
Use this page for process/layout literacy, not CMP process development or qualification.
Carry this boundary into any derivative note, paper draft, or slide.
EVIDENCE
Trace the claim back to artifacts.
The evidence route remains the catalog-level browser; this page is the simulation-level reading card.
The public JSON stores every density, width, overpolish, pad-age, dishing, erosion, and score row.
SA-PROC-CMP-001
The CSV export gives process learners a safe table for dummy-fill and metrology discussion.
SA-PROC-CMP-001
The card links process fundamentals with layout-density consequences in the domain browser.
SA-PROC-CMP-001
Source spine
These links anchor the public teaching model. They do not convert the replay into a qualified process recipe or signoff result.
Public execution boundary
No server-side live ngspice execution, uploads, accounts, payments, comments, newsletter signup, or job/event submissions are active on this page.