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SIMULATION / SA-MEM-003-HBM-THERMAL-ROOFLINE-001

HBM thermal bandwidth roofline
HBM Roofline

Replay stack height, target bandwidth, and cooling class to see usable bandwidth, energy per bit, and throttle risk together.

sectionExploresectionRun CardsectionExportsectionMethodssectionLimitssectionEvidence

EXPLORE

Start with the observable.

Use this page when the simulation is the primary artifact. The linked lesson explains the concept; the linked lab keeps the visual replay surface available.

guided exploration
  • Do not read HBM bandwidth without energy per bit and thermal headroom.
  • Compare target bandwidth and usable bandwidth under throttle risk.
  • Use stack height as a package/system knob, not just a capacity slogan.

RUN CARD

Conditions before conclusions.

This page replays saved HBM roofline data and does not run thermal CFD, package extraction, or vendor HBM models.

precomputed HBM thermal roofline sweep

Primary knobs

  • Stack height
  • Target bandwidth
  • Cooling class
outputs

Saved outputs

  • Power proxy
  • Thermal headroom
  • Usable bandwidth
  • Energy per bit

EXPORT

Download the public artifacts.

These exports are the supported public files for review. PDK files and restricted third-party material are not redistributed.

download

Dataset JSON

/data/hbm-thermal-bandwidth-roofline-web-v1.json

Open file ->
download

Dataset CSV

/data/hbm-thermal-bandwidth-roofline-v64.csv

Open file ->
download

v64 deep simulation summary CSV

/data/v64-deep-simulations-summary.csv

Open file ->
download

v64 deep model script

/data/v64_deep_semiconductor_sims.mjs

Open file ->
download

v64 deep model card

/data/v64-deep-simulations-model-card.md

Open file ->

METHODS

How the number was made.

Methods are written for citation discipline: the extraction rule matters as much as the plotted value.

method

Power proxy scales with target bandwidth and stack height.

Keep this method attached when reusing the figure or metric.

method

Thermal headroom penalizes higher power and improves under the enhanced cooling label.

Keep this method attached when reusing the figure or metric.

method

Usable bandwidth is reduced by a throttle-risk factor when headroom is low.

Keep this method attached when reusing the figure or metric.

LIMITS

What this page does not claim.

The MVP is useful because the limits are visible. These statements prevent a teaching simulation from being cited as silicon evidence.

non-claim

No vendor HBM stack, interposer, TSV, microbump, package, CFD, or workload measurement is included.

Carry this boundary into any derivative note, paper draft, or slide.

non-claim

No product comparison, procurement, or AI-system performance claim is made.

Carry this boundary into any derivative note, paper draft, or slide.

non-claim

Real HBM work needs package thermal data, workload traces, memory-controller data, and measurement.

Carry this boundary into any derivative note, paper draft, or slide.

EVIDENCE

Trace the claim back to artifacts.

The evidence route remains the catalog-level browser; this page is the simulation-level reading card.

evidence note

v64 deep results store every stack height, bandwidth, cooling, power, and headroom row.

SA-MEM-003-HBM-THERMAL-ROOFLINE-001

evidence note

CSV export preserves the thermal roofline table.

SA-MEM-003-HBM-THERMAL-ROOFLINE-001

evidence note

The memory hierarchy lesson separates HBM system role from DRAM cell physics.

SA-MEM-003-HBM-THERMAL-ROOFLINE-001

Public execution boundary

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