108 FITInfant dropUNKNOWNInspect metric contract
8 FITUseful lifeUNKNOWNInspect metric contract
4 modesStress modesUNKNOWNInspect metric contract
SIMULATION / SA-PTR-REL-STRESS-BATHTUB-001
Reliability stress and bathtub curve
Reliability Stress
Connect infant mortality, useful life, wearout, and accelerated stress vocabulary without claiming qualification.
EXPLORE
Start with the observable.
Use this page when the simulation is the primary artifact. The linked lesson explains the concept; the linked lab keeps the visual replay surface available.
- Read the bathtub curve as three regions before citing a reliability number.
- Compare stress-mode vocabulary for thermal, humidity, mechanical, and biased operation screens.
- Use the card to list which sample size, failure definition, and confidence data are missing.
RUN CARD
Conditions before conclusions.
The page replays saved reliability teaching data. It does not qualify devices, predict field FIT, or release product reliability claims.
Primary knobs
- Teaching time points: 1 to 50000 hours
- Outputs: failure-rate proxy, bathtub-region interpretation, stress-mode vocabulary
- Review focus: reliability language and missing evidence
- Boundary: no JEDEC qualification plan, FIT prediction, product release, or customer quality claim
Saved outputs
- bathtub trend table
- infant mortality check
- useful-life flat check
- wearout increase check
EXPORT
Download the public artifacts.
These exports are the supported public files for review. PDK files and restricted third-party material are not redistributed.
Dataset JSON
/data/ptr-accelerated-stress-bathtub-web-v1.json
Open file ->Model script
/data/ptr_models.py
Open file ->PTR model card
/data/ptr-model-card.md
Open file ->METHODS
How the number was made.
Methods are written for citation discipline: the extraction rule matters as much as the plotted value.
Represent reliability trend with six teaching time points and a failure-rate proxy.
Keep this method attached when reusing the figure or metric.
Check that early failure rate decreases, useful life is flat, and wearout increases.
Keep this method attached when reusing the figure or metric.
List stress modes as vocabulary prompts rather than a qualification plan.
Keep this method attached when reusing the figure or metric.
Keep sample size, censoring, failure definition, and confidence needs visible as missing data.
Keep this method attached when reusing the figure or metric.
LIMITS
What this page does not claim.
The MVP is useful because the limits are visible. These statements prevent a teaching simulation from being cited as silicon evidence.
No JEDEC qualification, accelerated-life model, activation energy, confidence bound, FIT prediction, product release, or warranty claim is included.
Carry this boundary into any derivative note, paper draft, or slide.
No real stress condition, sample size, failure-analysis result, field-return data, or customer quality evidence is represented.
Carry this boundary into any derivative note, paper draft, or slide.
The bathtub curve is a teaching shape and cannot prove reliability.
Carry this boundary into any derivative note, paper draft, or slide.
Real reuse requires qualified test plans, measured failures, censoring rules, statistics, failure analysis, and owner signoff.
Carry this boundary into any derivative note, paper draft, or slide.
EVIDENCE
Trace the claim back to artifacts.
The evidence route remains the catalog-level browser; this page is the simulation-level reading card.
The dataset preserves six bathtub time points and four stress-mode vocabulary cases.
SA-PTR-REL-STRESS-BATHTUB-001
Verification checks infant mortality decrease, useful-life flatness, wearout increase, and stress-mode count.
SA-PTR-REL-STRESS-BATHTUB-001
The model card keeps qualification, FIT prediction, and release boundaries explicit.
SA-PTR-REL-STRESS-BATHTUB-001
Source spine
These links anchor the public teaching model. They do not convert the replay into a qualified process recipe or signoff result.
NIST reliability metrology for semiconductorsPublic NIST publication page anchoring reliability assessment as a semiconductor metrology concern.NIST advanced semiconductor packaging material needsPublic NIST publication page on packaging materials, metrology, moisture reliability, residual stress, warpage, and reproducibility.SEMI Heterogeneous Integration RoadmapPublic roadmap page connecting assembly, packaging, interconnect, test, thermal management, and reliability.
Public execution boundary
No server-side live ngspice execution, uploads, accounts, payments, comments, newsletter signup, or job/event submissions are active on this page.