Package parasitics RLC budget
Compare teaching package cases by loop inductance, coupling capacitance, signal delay, and PDN impedance.
5 ps / 180 pH / 97.5%
Open simulation ->PACKAGING REPLAY LAB / SA-PTR-001
Package, test, reliability.
Read the back-end cards.
This lab collects four precomputed PTR simulations for paper-first review: package parasitics, thermal stack, wafer-sort guardband, and reliability stress vocabulary.
RUN ONE QUESTION
Pick the back-end claim first.
Every card keeps a condition, output, method, source, and limitation attached. The point is evidence discipline, not package or test release.
Package thermal resistance stack
Add junction-to-case and case-to-ambient resistance while keeping hotspot coupling visible.
15 C/W / 0.72 / 1.58 W
Open simulation ->Wafer sort binning and guardband
Replay a teaching guardband tradeoff between yield, top bin, estimated escapes, and retest load.
83% / 900 ppm / 4.2%
Open simulation ->Reliability stress and bathtub curve
Connect infant mortality, useful life, wearout, and accelerated stress vocabulary without claiming qualification.
108 FIT / 8 FIT / 4 modes
Open simulation ->MODEL BOUNDARY
Useful PTR intuition still needs a bright boundary.
The public replay is for teaching, figures, and early paper planning. It is not package signoff, thermal design release, bin-limit release, a production screen, reliability release, or a customer quality claim.
Browse saved datasets
Open package, thermal, sort, and reliability data with assumptions visible.
Download model cards
Use the public source notes and limitations when making slides, drafts, or teaching figures.
No qualification workflow
No account, upload, production tester run, package design release, field-return intake, reliability signoff, or customer-quality action is present.