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SASemiAgoraSemiconductor knowledge & engineeringOpen ALD sim

LESSON PACKET / SA-PROC-001

Thin-film deposition.
Flux becomes film.

Sputter, evaporation, and ALD belong together because each asks the same research question: what condition produced this film, and what evidence says it was uniform, conformal, or saturated?

lessonProcess ChainobjectsSimulation BundlepublicSource SpineroadmapData To Collect

PROCESS CHAIN

Teach the knob before teaching the recipe.

The MVP does not publish facility recipes. It teaches the observable: radial uniformity for sputter, line-of-sight shadowing for evaporation, and self-limiting cycle growth for ALD.

01 / PVD / SPUTTER

Uniformity is an evidence question.

A sputter film can hit the target thickness at wafer center while still losing thickness near the edge. Rotation helps average angular variation, but it does not erase radial geometry.

+/-3.97% / open simulation ->
02 / PVD / EVAPORATION

Open-field thickness is not sidewall coverage.

Thermal and e-beam evaporation are directional. A long throw can make the open field look good while topography still creates line-of-sight shadowing.

2.1 nm edge loss / open simulation ->
03 / CVD / ALD

Self-limiting growth still needs a window.

ALD turns cycle count into thickness only after each half-reaction saturates and the process stays inside a usable temperature and transport window.

0.11 nm/cycle / open simulation ->

SIMULATION BUNDLE

Paper-first users can skip straight to the artifact.

Each object keeps its run card, downloads, methods, limits, and source links attached. The lesson explains the ideas; the simulation pages carry the reusable evidence card.

Process / live-precomputed

Sputter deposition thickness uniformity

Replay radial film-thickness profiles to see why rotation, source shape, pressure regime, and geometry matter before a sputter recipe is trusted.

Open Sputter Uniformity ->
Process / live-precomputed

Thermal and e-beam evaporation line-of-sight

Compare long-throw and short-throw evaporation profiles, then separate open-field uniformity from sidewall shadowing.

Open Evaporation LOS ->
Process / live-precomputed

ALD growth-per-cycle saturation

Replay dose saturation, 100-cycle thickness arithmetic, temperature-window framing, and aspect-ratio conformality warnings.

Open ALD GPC ->
Process / live-precomputed

Sputter/PVD step coverage and continuity

Replay feature aspect ratio and scattering proxy to see why PVD coverage is not just blanket thickness.

Open PVD Step Coverage ->

SOURCE SPINE

Public sources anchor the model boundary.

These links support the teaching vocabulary. They do not authorize copying recipes, redistributing restricted manuals, or claiming tool qualification.

source

UIUC MRL deposition tools

https://mrl.illinois.edu/facilities/research-cores/micronano-fabrication-and-cleanroom/deposition-tools

Open source ->
source

George 2010 ALD overview

https://pubmed.ncbi.nlm.nih.gov/19947596/

Open source ->
source

Puurunen 2005 ALD surface chemistry

https://cris.vtt.fi/en/publications/surface-chemistry-of-atomic-layer-deposition-a-case-study-for-the/

Open source ->
source

NIST ALD publication record

https://www.nist.gov/publications/atomic-layer-deposition-mos2-films-using-bistert-butylimido-bisdimethylamidomolybdenum

Open source ->

DATA TO COLLECT NEXT

Useful process data must be measured and rights-clean.

For the next build, the best materials are public-safe metrology summaries. Recipe parameters can stay private while the evidence contract still improves.

needed

Measured witness-wafer thickness maps from public-safe demos

Store the data with conditions, metrology method, uncertainty, redistribution rights, and limitations.

needed

Ellipsometry, profilometry, or XRR summaries with uncertainty

Store the data with conditions, metrology method, uncertainty, redistribution rights, and limitations.

needed

ALD growth-per-cycle curves by pulse, purge, and temperature

Store the data with conditions, metrology method, uncertainty, redistribution rights, and limitations.

needed

Recipe-independent tool metadata that does not expose restricted facility settings

Store the data with conditions, metrology method, uncertainty, redistribution rights, and limitations.

needed

Film-property notes: stress, roughness, sheet resistance, leakage, or dielectric constant when public

Store the data with conditions, metrology method, uncertainty, redistribution rights, and limitations.

needed

Clear redistribution rights for every figure, dataset, and source note

Store the data with conditions, metrology method, uncertainty, redistribution rights, and limitations.

Public boundary

No live tool operation, recipe upload, account workflow, payment, comment, newsletter signup, job/event submission, or facility credential collection is active in this MVP.