0.91Balanced adhesion scoreUNKNOWNInspect metric contract
76 degBalanced contact angleUNKNOWNInspect metric contract
0.18Overprime risk deltaUNKNOWNInspect metric contract
SIMULATION / SA-PROC-CLEAN-HMDS-ADHESION-001
HMDS adhesion-prime readiness
HMDS Prime
Compare dehydration, hydrophobicity, adhesion score, and overprime or delay risk for public-safe lithography surface-prep review.
EXPLORE
Start with the observable.
Use this page when the simulation is the primary artifact. The linked lesson explains the concept; the linked lab keeps the visual replay surface available.
- Compare humid, dehydrate-only, balanced prime, and overprime or delay-risk cases.
- Read moisture, contact-angle proxy, adhesion score, and defect risk together.
- Use the card to decide what surface-state evidence belongs next to a lithography claim.
RUN CARD
Conditions before conclusions.
The public page replays saved HMDS teaching data. It does not operate lithography equipment, prescribe resist processing, or expose recipe settings.
Primary knobs
- Surface-state cases: humid no-prime, dehydrate-only, balanced HMDS prime, overprime or delay risk
- Outputs: moisture index, contact-angle proxy, adhesion score, defect risk
- Review focus: balanced readiness versus excessive hydrophobicity or delay
- Boundary: no hotplate, vapor prime, coater, track, resist, or bake settings
Saved outputs
- adhesion readiness table
- best-case check
- overprime or queue-risk warning
- public source spine
EXPORT
Download the public artifacts.
These exports are the supported public files for review. PDK files and restricted third-party material are not redistributed.
Dataset JSON
/data/process-hmds-adhesion-prime-web-v1.json
Open file ->Model script
/data/process_wet_clean_models.py
Open file ->Wet clean model card
/data/process-wet-clean-model-card.md
Open file ->METHODS
How the number was made.
Methods are written for citation discipline: the extraction rule matters as much as the plotted value.
Compare four normalized surface states using moisture, hydrophobicity, adhesion, and defect-risk proxies.
Keep this method attached when reusing the figure or metric.
Mark the balanced HMDS-prime case as best only inside the educational proxy table.
Keep this method attached when reusing the figure or metric.
Expose risk increase for overprime or delay as a separate non-claim.
Keep this method attached when reusing the figure or metric.
Keep adhesion vocabulary separate from any facility lithography procedure.
Keep this method attached when reusing the figure or metric.
LIMITS
What this page does not claim.
The MVP is useful because the limits are visible. These statements prevent a teaching simulation from being cited as silicon evidence.
No HMDS recipe, hotplate program, vapor-prime cycle, track setting, resist compatibility rule, facility procedure, or safety instruction is included.
Carry this boundary into any derivative note, paper draft, or slide.
No contact-angle, adhesion-test, defect-inspection, linewidth, overlay, or qualified metrology result is modeled.
Carry this boundary into any derivative note, paper draft, or slide.
The best case is an educational proxy and not a process-window recommendation.
Carry this boundary into any derivative note, paper draft, or slide.
Real lithography readiness requires local process qualification, material compatibility, queue-time control, and rights-clean measured data.
Carry this boundary into any derivative note, paper draft, or slide.
EVIDENCE
Trace the claim back to artifacts.
The evidence route remains the catalog-level browser; this page is the simulation-level reading card.
The dataset preserves four normalized adhesion-readiness cases.
SA-PROC-CLEAN-HMDS-ADHESION-001
Verification checks moisture reduction, hydrophobicity increase, balanced best score, and overprime-risk increase.
SA-PROC-CLEAN-HMDS-ADHESION-001
Stanford HMDS source notes anchor the adhesion-promoter vocabulary.
SA-PROC-CLEAN-HMDS-ADHESION-001
Source spine
These links anchor the public teaching model. They do not convert the replay into a qualified process recipe or signoff result.
Stanford SNF HMDSPublic SNF guide page describing HMDS as a photoresist adhesion promoter.Stanford SNF Standard Clean 1Public SNF chemical page anchoring SC1 as a particle and surface-preparation clean before growth furnaces.NIST CHIPS Metrology ProgramPublic NIST page framing fit-for-purpose measurement as a core semiconductor capability as device structures become smaller and more layered.
Public execution boundary
No server-side live ngspice execution, uploads, accounts, payments, comments, newsletter signup, or job/event submissions are active on this page.