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PROCESS REPLAY LAB / SA-PROC-006

Wet clean and surface prep.
Compare the surface-state cards.

This lab collects four precomputed wet-clean and adhesion-prep simulations for paper-first review: contamination class, native oxide, HMDS readiness, and sequence evidence queue.

RUN ONE QUESTION

Pick the surface claim first.

Every card keeps a condition, output, method, source, and limitation attached. The point is evidence discipline, not facility operation.

Process / live-precomputed

Wet clean contamination removal

Compare conceptual organic, particle, metal, and native-oxide proxies across a public-safe wet-clean evidence sequence.

88.0% / 80.0% / 80.0%

Open simulation ->
Process / live-precomputed

Dilute HF native-oxide window

Replay a normalized native-oxide removal window with hydrophobicity, reoxidation sensitivity, and queue-time caution shown together.

0.22 nm / 84 deg / 0.78

Open simulation ->
Process / live-precomputed

HMDS adhesion-prime readiness

Compare dehydration, hydrophobicity, adhesion score, and overprime or delay risk for public-safe lithography surface-prep review.

0.91 / 76 deg / 0.18

Open simulation ->
Process / live-precomputed

Clean sequence decision queue

Map downstream process intent to surface target, evidence needs, and risk flags without publishing a wet-bench or lithography flow.

16 / 4 / 0.802

Open simulation ->

MODEL BOUNDARY

Surface intuition is useful only when the boundary is loud.

The public replay is for teaching, figures, and early paper planning. It is not a wet-bench recipe, HF procedure, lithography track flow, contact qualification, wafer release rule, or signoff result.

allowed

Browse saved datasets

Open contamination, native oxide, HMDS, and clean-sequence data with their assumptions visible.

allowed

Download model cards

Use the public source notes and limitations when making slides, drafts, or teaching figures.

blocked

No recipe workflow

No process upload, tool account, facility credential, live execution, endpoint control, release dashboard, or qualified process-window claim is present.