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SASemiAgoraSemiconductor knowledge & engineeringOpen lesson

SIMULATION / SA-PROC-THERM-BUDGET-COMPARE-001

Spike versus furnace thermal budget
Thermal Budget

Compare furnace soak, spike RTA, and millisecond anneal modes so shallow-junction benefit and temperature-control risk stay visible together.

sectionExploresectionRun CardsectionExportsectionMethodssectionLimitssectionEvidence

EXPLORE

Start with the observable.

Use this page when the simulation is the primary artifact. The linked lesson explains the concept; the linked lab keeps the visual replay surface available.

guided exploration
  • Compare furnace soak, spike RTA, and millisecond anneal side by side.
  • Look for the shallowest junction proxy before reading the temperature-control risk.
  • Use the card to ask what metrology is missing from a paper's anneal comparison.
Open visual lab ->Open lesson ->

RUN CARD

Conditions before conclusions.

The public page replays saved teaching data. It does not optimize recipes, control equipment, or prescribe an anneal mode.

precomputed replay

Primary knobs

  • Anneal mode: furnace soak, spike RTA, millisecond anneal
  • Relative duration: long, short, very short
  • Outputs: activation score, diffusion broadening, uniformity score, temperature-control risk
  • Boundary: comparison vocabulary, not a process recommendation
outputs

Saved outputs

  • thermal budget index
  • diffusion broadening proxy
  • uniformity and control-risk scores
  • paper-review warning

EXPORT

Download the public artifacts.

These exports are the supported public files for review. PDK files and restricted third-party material are not redistributed.

download

Dataset JSON

/data/process-spike-vs-furnace-thermal-budget-web-v1.json

Open file ->
download

Model script

/data/process_thermal_processing_models.py

Open file ->
download

Thermal model card

/data/process-thermal-processing-model-card.md

Open file ->

METHODS

How the number was made.

Methods are written for citation discipline: the extraction rule matters as much as the plotted value.

method

Treat each anneal mode as a normalized public teaching case.

Keep this method attached when reusing the figure or metric.

method

Compare diffusion broadening and shallow-junction score before using activation score.

Keep this method attached when reusing the figure or metric.

method

Report temperature-control risk separately from activation benefit.

Keep this method attached when reusing the figure or metric.

method

Keep furnace uniformity and aggressive short-time processing as different review dimensions.

Keep this method attached when reusing the figure or metric.

LIMITS

What this page does not claim.

The MVP is useful because the limits are visible. These statements prevent a teaching simulation from being cited as silicon evidence.

non-claim

No furnace tube recipe, RTA chamber program, laser scan path, ramp-rate setpoint, ambient, or wafer-carrier procedure is included.

Carry this boundary into any derivative note, paper draft, or slide.

non-claim

No calibrated heat-transfer model, emissivity correction, pyrometer uncertainty, wafer pattern absorption, or production uniformity data is modeled.

Carry this boundary into any derivative note, paper draft, or slide.

non-claim

The millisecond case is a vocabulary anchor, not a recommendation or facility capability claim.

Carry this boundary into any derivative note, paper draft, or slide.

non-claim

Real comparisons require temperature metrology, sheet resistance, chemical profiles, spatial uniformity, leakage, and rights-clean measured data.

Carry this boundary into any derivative note, paper draft, or slide.

EVIDENCE

Trace the claim back to artifacts.

The evidence route remains the catalog-level browser; this page is the simulation-level reading card.

evidence note

The dataset preserves three anneal-mode teaching cases.

SA-PROC-THERM-BUDGET-COMPARE-001

evidence note

Verification checks diffusion decreases while control risk increases for more aggressive modes.

SA-PROC-THERM-BUDGET-COMPARE-001

evidence note

The source spine keeps RTA, laser-anneal, and facility-capability context separate from recipe claims.

SA-PROC-THERM-BUDGET-COMPARE-001

Source spine

These links anchor the public teaching model. They do not convert the replay into a qualified process recipe or signoff result.

Optimal control of rapid thermal annealingOpen PDF discussing RTA, ultrashallow junctions, TED, sheet-resistance tradeoffs, and temperature trajectory control.COMSOL Rapid Thermal Annealing modelPublic model page describing RTA as dopant activation and metal-contact interfacial reaction with transient heat transfer.NIST laser annealed arsenic ultrashallow junctionsPublic NIST publication page for laser anneal, activation/deactivation, Hall, EXAFS, and SIMS context.NIST Semiconductor Electronics Division facility summaryPublic NIST report listing microfabrication facility capabilities including furnaces, thermal oxidation, CVD, and annealing.

Public execution boundary

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