Activation and diffusion compete.
A post-implant anneal makes dopants electrically useful, but the same thermal exposure broadens the depth profile. A useful claim keeps both numbers visible.
91.71% / 16.52 nm / open simulation ->LESSON PACKET / SA-PROC-005
Thermal annealing and RTA.
Heat changes the evidence.
Annealing is where implantation damage, electrical activation, diffusion, contact reaction, and thermal-budget limits collide. The MVP keeps those tradeoffs visible without publishing facility recipes.
THERMAL CHAIN
Teach the tradeoff before teaching the setting.
For public education, anneal should be framed as evidence: active fraction, diffusion broadening, defect recovery, sheet resistance, and morphology risk. Equipment settings stay outside the MVP.
The time-temperature shape matters.
Furnace soak, spike RTA, and millisecond anneal are not interchangeable. Shorter exposure can protect junction abruptness while raising metrology and uniformity risk.
0.36 budget index / open simulation ->Repairing damage can also feed TED.
Post-implant damage recovery, activation, and transient enhanced diffusion must be reviewed together before a shallow-junction figure becomes persuasive.
73.0% at t=10 / open simulation ->A contact anneal has a window.
Under-reaction leaves high resistance; over-anneal raises morphology risk. The teaching card keeps sheet resistance and agglomeration risk side by side.
4.4 ohm/sq / open simulation ->SIMULATION BUNDLE
Start from the run card if you are writing a paper.
Each object carries Explore, Run Card, Export, Methods, Limits, and Evidence. The lecture gives the causal chain; the simulation page carries the reusable artifact.
RTA activation and diffusion tradeoff
Replay normalized rapid-thermal-anneal budgets to compare dopant activation, diffusion broadening, and sheet-resistance proxy.
Open RTA Tradeoff ->Spike versus furnace thermal budget
Compare furnace soak, spike RTA, and millisecond anneal modes so shallow-junction benefit and temperature-control risk stay visible together.
Open Thermal Budget ->Implant damage recovery and TED
Replay post-implant defect recovery, activated fraction, and transient-enhanced-diffusion tail growth on one normalized anneal axis.
Open Damage / TED ->Silicide contact anneal window
Replay under-reacted, target-window, and over-annealed contact cases so sheet resistance and morphology risk stay paired.
Open Silicide Window ->Anneal activation versus dopant diffusion
Replay temperature and time to compare activation fraction, diffusion length, and a junction tradeoff score without exposing anneal recipes.
Open Anneal Tradeoff ->Anneal activation to device and FO4 delay interactive lab
Filter anneal method, temperature, time, and implant dose to inspect activation, diffusion, sheet resistance, Vt shift, and FO4-delay teaching proxies.
Open Anneal Chain ->Contact resistance to delay interactive chain
A browser CSV lab connecting surface/contact preparation, silicide anneal, contact area, activation proxy, Rc/Rsd proxy, ring oscillator delay proxy, and SRAM bitline delay proxy.
Open Contact Rc Chain ->SOURCE SPINE
Public sources anchor the vocabulary.
These links are teaching anchors. They do not authorize recipe copying, restricted manual redistribution, or qualification claims.
MIT OCW 6.152J ion implantation lecture
https://ocw.mit.edu/courses/6-152j-micro-nano-processing-technology-fall-2005/resources/lecture6/
Open source ->MIT OCW 6.774 front-end processing
https://ocw.mit.edu/courses/6-774-physics-of-microfabrication-front-end-processing-fall-2004/
Open source ->MIT OCW 6.774 TED lecture page
https://ocw.mit.edu/courses/6-774-physics-of-microfabrication-front-end-processing-fall-2004/resources/mit6_774f04_lec15_mp4/
Open source ->MIT OCW 6.774 silicides and contacts
https://ocw.mit.edu/courses/6-774-physics-of-microfabrication-front-end-processing-fall-2004/resources/mit6_774f04_lec22_mp4/
Open source ->Optimal control of rapid thermal annealing
https://web.mit.edu/braatzgroup/70_Optimal_control_of_rapid_thermal_annealing_in_a_semiconductor_process.pdf
Open source ->COMSOL Rapid Thermal Annealing model
https://www.comsol.com/model/rapid-thermal-annealing-504
Open source ->NIST laser annealed arsenic ultrashallow junctions
https://www.nist.gov/publications/deactivation-sub-melt-laser-annealed-arsenic-ultra-shallow-junctions-silicon-during
Open source ->NIST Semiconductor Electronics Division facility summary
https://nvlpubs.nist.gov/nistpubs/Legacy/IR/nistir6430.pdf
Open source ->DATA TO COLLECT NEXT
Anneal evidence becomes valuable when metrology is attached.
The next upgrade is rights-clean measurement summaries with uncertainty and non-claims, not secret recipes or facility control settings.
Sheet-resistance maps after implant/anneal splits with dose, species, and measurement method separated from recipe details
Store the data with method, uncertainty, material stack, source rights, and what the result does not prove.
SIMS depth profiles before and after anneal, with junction-depth extraction rules and uncertainty notes
Store the data with method, uncertainty, material stack, source rights, and what the result does not prove.
Hall activation or spreading-resistance summaries that separate active carrier density from total chemical dose
Store the data with method, uncertainty, material stack, source rights, and what the result does not prove.
Defect-recovery evidence such as TEM summaries, leakage metrics, or defect-density proxies with rights-clean source notes
Store the data with method, uncertainty, material stack, source rights, and what the result does not prove.
Silicide contact-chain, Kelvin, or TLM resistance summaries with line width, contact size, and metrology boundary
Store the data with method, uncertainty, material stack, source rights, and what the result does not prove.
Temperature-uniformity and calibration notes that are public-safe and do not expose facility operating procedures
Store the data with method, uncertainty, material stack, source rights, and what the result does not prove.
Public boundary
No live tool operation, recipe upload, account workflow, payment, comment, newsletter signup, job/event submission, endpoint control, release dashboard, or facility credential collection is active in this MVP.