RTA activation and diffusion tradeoff
Replay normalized rapid-thermal-anneal budgets to compare dopant activation, diffusion broadening, and sheet-resistance proxy.
91.71% / 16.52 nm / 386.8 ohm/sq
Open simulation ->PROCESS REPLAY LAB / SA-PROC-005
Thermal annealing.
Compare the evidence cards.
This lab collects four precomputed thermal-processing simulations for paper-first review: RTA activation, thermal budget mode, damage recovery, and silicide contact window.
RUN ONE QUESTION
Pick the thermal claim first.
Every card keeps a condition, output, method, source, and limitation attached. The point is evidence discipline, not facility operation.
Spike versus furnace thermal budget
Compare furnace soak, spike RTA, and millisecond anneal modes so shallow-junction benefit and temperature-control risk stay visible together.
0.36 / 3.2 nm / 0.92 score
Open simulation ->Implant damage recovery and TED
Replay post-implant defect recovery, activated fraction, and transient-enhanced-diffusion tail growth on one normalized anneal axis.
73.0% / 30.84% / 29.97 nm
Open simulation ->Silicide contact anneal window
Replay under-reacted, target-window, and over-annealed contact cases so sheet resistance and morphology risk stay paired.
4.4 ohm/sq / 88% / 0.72
Open simulation ->Anneal activation versus dopant diffusion
Replay temperature and time to compare activation fraction, diffusion length, and a junction tradeoff score without exposing anneal recipes.
-1.1309 / 850 C / 1 s / 25 cases
Open simulation ->Anneal activation to device and FO4 delay interactive lab
Filter anneal method, temperature, time, and implant dose to inspect activation, diffusion, sheet resistance, Vt shift, and FO4-delay teaching proxies.
135 cases / 21.52 ps / heatmap slices
Open simulation ->Contact resistance to delay interactive chain
A browser CSV lab connecting surface/contact preparation, silicide anneal, contact area, activation proxy, Rc/Rsd proxy, ring oscillator delay proxy, and SRAM bitline delay proxy.
144 / 3 / 4 / 0
Open simulation ->MODEL BOUNDARY
Thermal intuition is useful only when the boundary is loud.
The public replay is for teaching, figures, and early paper planning. It is not a furnace recipe, RTA program, laser process, contact qualification, wafer release rule, or signoff result.
Browse saved datasets
Open RTA, thermal budget, implant recovery, and silicide window data with their assumptions visible.
Download model cards
Use the public source notes and limitations when making slides, drafts, or teaching figures.
No recipe workflow
No process upload, tool account, facility credential, live execution, endpoint control, release dashboard, or qualified process-window claim is present.