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EE Times / arXiv semiconductor API / NVIDIA Developer BlogCompanyIndustry
Firebird Launches CIS Region’s Largest AI Factory in Armenia
The global buildout of AI infrastructure reached a new milestone today — Firebird, an emerging AI cloud, launched the CIS region’s largest AI factory in Armenia, establishing a new AI computing hub powered by NVIDIA accelerated computing and Dell Technologies high-performance AI infrastructure. Nikol Pashinyan, prime...
NewsAI Chips
After Seven CEOs in 10 Years, Imagination Is Sticking to Its Strategy
Imagination dumps CPU/NPU dreams, doubles down on GPUs and China under CEO No. 7. The post After Seven CEOs in 10 Years, Imagination Is Sticking to Its Strategy appeared first on EE Times .
NewsManufacturing
Mathematical Model Explains Bondwave Velocity and its Acceleration in Direct Wafer-Wafer Bonding (imec)
An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates.” Abstract: “Bonding and assembly processes have started to take the centre-stage in semiconductor manufacturing as they enable three-dimensional (3D) stacking and heterogeneous integration for novel interconnect architectures...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Permutation invariant neural network prediction of vacancy formation under deformation and varying chemical environment in FCC high entropy alloys
Vacancy formation energies govern diffusion, irradiation damage, phase stability, and dynamic failure in high-entropy alloys (HEAs), yet their strong dependence on local chemical environments and mechanical deformation makes atomistic calculations prohibitively expensive for large-scale studies. Here, we develop an atomistically informed permutation invar...
Aug 7, 2026Materials
Semiconductor Engineering / News
Ultrafast X-Ray Diffraction Maps Thermal Transport In GaN Thin Films (MIT, SLAC, Stanford, Argonne)
Researchers from MIT, SLAC, Stanford University, and Argonne National Laboratory published a technical paper titled “Spatiotemporal mapping of anisotropic thermal transport in GaN thin films via ultrafast X-ray diffraction.” Abstract Excerpt: The paper presents a “non-contact, spatiotemporal-resolved ultrafast X-ray diffraction method to extract in-plane...
Aug 7, 2026AI Chips
arXiv semiconductor API / Paper
Topology Inference for Immune System Networks by Using Cell Amount Data
Recent years have witnessed the advanced development of topology inference research, which helps elucidate the interaction relationships of components in many biological networks. This paper focuses on inferring the topology of a group of immune cells, based on the collected data from cell-depletion based experiments. The...
Aug 7, 2026Research
arXiv semiconductor API / Paper
DynaCrys: Crystal Generation with Dynamic Space-Group Diffusion
The search for new crystalline materials spans an enormous compositional and structural space. Generating candidates in this space requires jointly modeling discrete crystallographic symmetry, elemental composition, and continuous geometry. We introduce DynaCrys, a generative model for crystals in which the space group co-evolves with Wyckoff occupations...
Aug 7, 2026Industry
Semiconductor Engineering / News
Rapid Switching of Optical Properties in a Doped Semiconductor By Femtosecond Laser Pulses (Imperial College London, U. of Exeter)
Researchers from Imperial College London and University of Exeter published a technical paper titled “Ultrafast switching of optical properties in a doped semiconductor by intense femtosecond laser pulses.” Abstract “The rapid switching of materials when excited by ultrashort pulses of light is central for many optical...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Type-II Mirror Chern Insulator in Altermagnets
Altermagnets with momentum-dependent spin splitting despite zero net magnetization can support unique topological states under broken time-reversal symmetry. We predict a mirror-symmetry-protected topological crystalline insulator with momentum-separated edge modes in a two-dimensional altermagnet. Using a square-octagon lattice model, we show that alterm...
Aug 7, 2026Industry
EE Times / News
ROLEC’s technoPLUS: IP-rated Pole-mount Plastic Enclosures for IoT/IIoT and Factory Automation
IoT/IIoT and factory automation are driving demand for ROLEC’s updated pole-mountable technoPLUS (IP 66, IP 67, IP 69K) plastic enclosures. Electronics designers specify them for ‘close-to-the-process’ devices that must survive dust, moisture and regular washdowns. Compact technoPLUS provides robust protection – allowing industrial electronics to be...
Aug 7, 2026Memory
EE Times / News
BIWIN and Tera Indústria de Semicondutores Sign Strategic Partnership Agreement
Shenzhen, China / Manaus, Brazil – August 6th, 2026: BIWIN Semiconductor (HK) Company Limited (“BIWIN”), a global provider of memory and storage packaging solutions, and TERA INDÚSTRIA DE SEMICONDUTORES S.A. (“Tera”), a Brazil-based semiconductor memory packaging company, announce the signing of a strategic partnership framework agreement...
Aug 7, 2026AI Chips
arXiv semiconductor API / Paper
Do We Still Need Demand Flexibility as Batteries Become Cheaper? A Levelized Cost Perspective
Energy storage and flexible loads both help balance power systems with high shares of variable renewables, but they do so differently. A battery moves electricity from one period to another. A factory or data center instead moves production or computing activity, while meeting demand for its...
Aug 7, 2026Materials
Semiconductor Today Features / News
GaN HEMT short-circuit performance
Researchers based in China claim record short-circuit (SC) performance for 650V Schottky p-GaN high-electron-mobility transistors (HEMTs)...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Segmental Dynamics in the Strain-hardening Regime for Poly(methyl methacrylate) Glasses with and without Melt-stretching
Strain-hardening is a feature of polymer glasses during large deformation, which helps to stabilize the glasses against breakage. Experimentally, little is known about the segmental dynamics during strain-hardening, and such data is important for building a molecular-level theory of polymer glasses deformed in this regime. Here,...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Entwined lattice of atoms and anionic electrons in layered electride LaCl
Controlling the lattice geometry that governs electronic structure is a central theme in condensed-matter physics, yet in crystalline solids this geometry is usually fixed by the atomic framework. Electrides offer an alternative route to electronic structure design in which their excess electrons can organize into anionic...
Aug 7, 2026Manufacturing
arXiv semiconductor API / Paper
Surface Equilibration Mechanism Controls the Stability of a Model Co-deposited Glass Mixture of Organic Semiconductors
While previous work has identified the conditions for preparing ultrastable single-component organic glasses by physical vapor deposition (PVD), little is known about the stability of co-deposited mixtures. Here, we prepared binary PVD glasses of organic semiconductors, TPD (N,N-Bis(3-methylphenyl)-N,N-diphenylbenzidine) and m-MTDATA (4,4,4-Tris[phenyl(m-...
Aug 7, 2026Manufacturing
arXiv semiconductor API / Paper
Overaging with stress in polymer glasses? Faster segmental dynamics despite larger yield stress!
It is well known that physical aging of polymer glasses increases their yield stress and affects their failure behavior. Studies indicate that application of moderate levels of stress during aging results in higher yield stress compared to aging in the absence of stress (quiescent aging). This...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Dynamically reconfigurable THz quantum walk comb laser through subharmonic excitation
On-chip frequency combs are increasingly relevant to both laser science and applications. Broad bandwidths and flat-top spectral envelopes are especially desirable for precision spectroscopy and dense wavelength-division multiplexed communications. Toward these goals, active microwave modulation has emerged as a powerful strategy for generating, stabilizi...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Flip-chip integrated superconducting qubits using electroplated bump bonds
Flip-chip integration offers a promising route toward scalable superconducting quantum processors and hybrid semiconductor-superconductor quantum devices. We develop a three-dimensional transmon architecture using electroplated indium in which the qubit electric field is shared nearly equally between two bump-bonded substrates while maintaining low partic...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Fractional Spin Ferroelectric and Sliding Spin Current in Magnetic Sliding Ferroelectrics
We investigate the fractional spin ferroelectric (FSFE) in magnetic sliding ferroelectrics (SFEs), where ferroelectric switching is characterized not only by the reversal of the out-of-plane electric polarization but also by a variation of fractional in-plane spin electronic polarization. We show that interlayer sliding in FSFEs can...
Aug 7, 2026AI Chips
arXiv semiconductor API / Paper
Synthesizing Voltage Ride-Through Controllers for Data Centers
Data centers are among the power grid's fastest-growing loads. Since data center servers are sensitive electronic components, they need to be protected against the grid's voltage disturbances during grid faults. While disconnecting from the grid achieves this, it can further destabilize the power system if many...
Aug 7, 2026Manufacturing
Semiconductor Today News / News
Nokia acquires NXP’s fab in Chandler, Arizona, for conversion to InP optical comms
Finland-based telecom equipment maker Nokia Corp says that, as part of its long-term plans for optical component manufacturing capacity expansion, it has entered into a definitive agreement to acquire the Chandler Semiconductor Fabrication campus in Arizona of NXP Semiconductors N.V. of Eindhoven, The Netherlands. Opened in...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Grid-Compatible Flexibility from Multi-Energy Systems via Cyclic-Terminal Economic MPC with Hybrid Thermal-Electrical Dynamics
Coupled electrical and thermal infrastructures need controllers that respond to market prices and still solve fast enough to run online. This paper presents a unified Economic Model Predictive Control (EMPC) framework for the coordinated operation of integrated thermal and electrical energy networks. Building on cyclic-terminal EMPC,...
Aug 7, 2026Materials
arXiv semiconductor API / Paper
Homojunction-induced thermopower enhancement in polymer films
It has been more than twenty years since conductive polymers began to receive attention as an emerging thermoelectric material. However, the trade-off between electrical conductivity (σ) and thermopower (S) has proven to be a major challenge that has obstructed their use in actual devices. Here we...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Crossing over universal scaling laws in two-dimensional driven dissipative condensates
In low dimensional systems, fluctuations are enhanced and prevent the spontaneous breaking of continuous symmetries. As a result, spatial and temporal correlation functions decay at large distances and long times. A well established example is given by two-dimensional bosonic condensates at equilibrium, which do not display...
Aug 7, 2026Packaging
EE Times / News
Chiplet Architectures as a Practical Path to Scalable Automotive Compute
Chiplets are auto’s escape hatch from bloated SoCs, scaling SDV compute without wrecking cost or software. The post Chiplet Architectures as a Practical Path to Scalable Automotive Compute appeared first on EE Times .
Aug 7, 2026AI Chips
arXiv semiconductor API / Paper
Dual-Node NVIDIA DGX Spark over Tailscale: A Remote-Access Testbed for Distributed LLM Training and Cyber-Threat-Intelligence Fine-Tuning
Compact AI systems make local language-model experimentation increasingly accessible, yet practical evidence for multi-node training on desktop-class accelerators remains limited. This report presents a proof-of-concept deployment of distributed NanoChat pretraining across two NVIDIA DGX Spark systems, each with a GB10 Grace Blackwell system-on-chip and 1...
Aug 7, 2026AI Chips
arXiv semiconductor API / Paper
Toward a Causal Data Management Ecosystem for Decision Making and Agentic AI
Modern AI is no longer a single model but an ecosystem: classical ML predictors, deep and multimodal models, large language models, and agents, each trained and tuned over different data sources and each producing outputs at scale that become inputs to the others. Operating such an...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Exploring the Relaxation Landscape of a 2D Quantum Magnet on a 256-Qubit Processor
How quantum matter relaxes far from equilibrium is a central open problem in many-body physics, and one for which analog quantum simulators are well positioned to move from confirming theory to discovering new physics. Here, we use a two-dimensional Rydberg atom array of 256 qubits to...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Stability Enhancement in Weak Grids with High Renewable Penetration: Synchronous Condenser vs. Converter-based Technologies
Integrating renewable energy sources into weak grids presents significant challenges for maintaining grid stability. Several essential services are required to ensure a stable and secure grid, including voltage support, fault current injection, system strength support, frequency control, and inertia support. Synchronous condensers, with their inherent ine...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Morphology Engineering of Mixed Ionic Electronic Conductors through Aqueous Phase Separation
The performance of organic electrochemical transistors (OECTs) is fundamentally governed by the interplay between ionic accessibility and electronic transport within organic mixed ionic-electronic conductors. Although increasing channel thickness enhances transconductance, it also prolongs ion transport, resulting in the well-known gain-speed trade-off. H...
Aug 7, 2026Materials
arXiv semiconductor API / Paper
Niobium Titanium Nitride as a High Tensile Stress Material for Nanomechanics
Over the past decades, high-coherence mechanical resonators have been continuously pushed to new limits, using techniques such as dissipation dilution and clamp-tapering to enhance their quality factor beyond intrinsic material limitations. Today, these mechanical resonators are often fabricated from silicon-nitride, silicon-carbide or aluminum. Recently,...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Certified Detection of Bifurcation Candidates in Uncertain Nonlinear Systems using Interval Analysis
Qualitative transitions in nonlinear dynamical systems (e.g., loss of stability, onset of oscillations, emergence of multistability) delimit operating regimes and can arise as implicit constraints in robust analysis and design under parametric uncertainty. When parameters are inferred from data, admissible values are naturally represented as uncertainty...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Free-Horizon Newton Method for Nonlinear Optimal Control
This paper presents a novel trajectory optimization method for nonlinear l1-optimal control problems in which the control horizon is treated as a free variable, allowing both the control duration and the l1-norm of the control input to be evaluated. Unlike traditional approaches that minimize the l1-norm...
Aug 7, 2026Industry
EE Times / News
Inside Device Connectivity: A New Design Discipline for Next-Gen Vehicles
Join this webinar where our expert will introduce Inside Device Connectivity as a focused design discipline to ensure power, signal, and data move predictably and robustly within automotive electronics. The post Inside Device Connectivity: A New Design Discipline for Next-Gen Vehicles appeared first on EE Times...
Aug 7, 2026Research
arXiv semiconductor API / Paper
Net and Hidden Spin-Valley Locking Enable Ultrahigh Hole Mobility in Covalent Bulk WN$_2$
High carrier mobility at room temperature underpins high-performance electronics, yet high hole mobility remains rare in bulk semiconductors. Spin-valley locking can suppress intervalley scattering and enhance mobility, but it is limited to materials with broken inversion symmetry. Hidden spin polarization offers a possible route beyond this...
Aug 7, 2026Industry
Semiconductor Today News / News
NUBURU receives Italian Golden Power clearance to acquire 70% of Tekne
NUBURU Inc of Centennial, CO, USA (a dual-use defense & security integrated platform company) says that the Italian Government has authorized the proposed acquisition by NUBURU Defense LLC of a 70% controlling interest in Tekne S.p.A. under Italy’s Golden Power framework...
Aug 7, 2026Industry
EE Times / News
STMicroelectronics Bets on Hardware-Based Post-Quantum Cryptography with ST54M
ST’s ST54M bakes post-quantum crypto into phone hardware before hackers harvest today’s secrets. The post STMicroelectronics Bets on Hardware-Based Post-Quantum Cryptography with ST54M appeared first on EE Times .
Aug 7, 2026Materials
Semiconductor Today Features / News
Reducing micro-LED sidewall impact
Researchers based in China have reported 34% enhanced external quantum efficiency (EQE) of a 5μm gallium nitride (GaN) blue light-emitting diode (LED) from a neutral reactive nitrogen/hydrogen (N/H) treatment...
Aug 7, 2026Industry
Semiconductor Today News / News
Former Coherent CEO Chuck Mattera joins Uviquity as strategic advisor
Uviquity of Raleigh, NC, USA – a venture-backed start-up founded in 2022 that is pioneering integrated photonics, developing photonic integrated circuits (PICs) on a proprietary aluminium nitride (AlN) platform for quantum and ultraviolet applications – says that Dr Vincent D. (Chuck) Mattera Jr, founder & CEO...
Aug 7, 2026Memory
Semiconductor Engineering / News
Chip Industry Week in Review
SK hynix's $38B new fabs; memory density increases; 2026 chip industry revenue to hit $1.65T; imec metrology roadmap; MIT's self-assembled contacts; new U.S. restrictions; Intel's new training program; NXP to buy Ambarella?; AI sandbox leaks; memory-centric accelerator; entangled photons; CHIPS Act spending under scrutiny. The post...
Aug 6, 2026AI Chips
EE Times / News
AI Chip Startup Taalas Acquired by AMD
AMD plans to use Taalas chips alongside its GPUs for AI inference, likely as an LLM decode accelerator. The post AI Chip Startup Taalas Acquired by AMD appeared first on EE Times .
Aug 6, 2026AI Chips
EE Times / News
GlobalFoundries’ Growth Makes the Case for a U.S. Photonics Buildout
GlobalFoundries’ data center surge turns U.S. photonics from subsidy pitch to AI bottleneck bet. The post GlobalFoundries’ Growth Makes the Case for a U.S. Photonics Buildout appeared first on EE Times .
Aug 6, 2026Industry
Semiconductor Today Features / News
More thermally stable indium phosphide quantum dot near-infrared laser diodes
Hong Kong University of Science and Technology (HKUST) in China reports multi-stack indium phosphide (InP) quantum dot (QD) 780nm lasers on silicon (Si) with a high characteristic temperature (T0) of 125K in the near infrared (NIR)...
Aug 6, 2026Materials
Semiconductor Today News / News
Wolfspeed and LITEON partner on 800VDC power solutions for hyperscale AI data centers
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — and AI power solutions provider LITEON Technology Corp of Hsinchu, Taiwan have announced a strategic partnership and the qualification of Wolfspeed’s silicon carbide technology for deployment within LITEON’s...
Aug 6, 2026Industry
NVIDIA Newsroom / Company
GeForce NOW Shakes Up August With 26 New Games
August is here, bringing 26 new games for GeForce NOW members. Command the seas in World of Warships: Legends and discover what’s next in the GeForce NOW library, starting with the eight newly added games this week. In addition, GeForce NOW is at the QuakeCon gaming...
Aug 6, 2026Industry
NVIDIA Newsroom / Company
Into the Omniverse: How Open World Models Push the Frontier of Physical AI
In July, NVIDIA joined more than 200 companies and organizations in signing “Open Weights and American AI Leadership,” an open letter arguing that AI leadership will be measured not by any single frontier model but by whether an open ecosystem reaches every sector.
Aug 6, 2026Manufacturing
EE Times / News
U.S. Manufacturing Activity Hits Four-Year High in July
In July, U.S. manufacturing activity remained in expansion territory, growing at its fastest pace in more than four years. The post U.S. Manufacturing Activity Hits Four-Year High in July appeared first on EE Times .
Aug 6, 2026Manufacturing
Semiconductor Today News / News
Veeco receives LUMINA+ MOCVD system order for manufacturing InP lasers
Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that a global leader in optical and photonic technologies has selected its LUMINA+ metal-organic chemical vapor deposition (MOCVD) system to fabricate indium phosphide (InP) lasers for innovative communication solutions in the datacom...
Aug 6, 2026Manufacturing
EE Times / News
Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
Europe's next semiconductor champions will emerge from design expertise, customer knowledge, and IP—not manufacturing capacity alone. The post Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions appeared first on EE Times .
Aug 6, 2026Materials
Semiconductor Today Features / News
Taking heat off AlGaN-channel HEMTs
Pennsylvania State University (PSU) and Cornell University in the USA claim record-high thermal performance for an ultra-wide-bandgap aluminium gallium nitride (AlGaN)-channel high-electron-mobility transistor (HEMT)...
Aug 6, 2026Industry
Semiconductor Today News / News
Skyworks’ Mobile revenue drop offset by automotive and data-center growth
For its fiscal third-quarter 2026 (ended 3 July), Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) has reported revenue of $934.8m, down 1% on $943.7m last quarter and 3.1% on $965m a year ago, but above the mid-point of the $900–950m...
Aug 6, 2026Industry
Semiconductor Engineering / News
Separating The Chaff From The Wheat: Focusing On Only The RDC Violations You Care About
Combine structural analysis with timing awareness and context-based classification to distinguish real design risks from safe implementation choices. The post Separating The Chaff From The Wheat: Focusing On Only The RDC Violations You Care About appeared first on Semiconductor Engineering .
Aug 6, 2026Industry
Semiconductor Engineering / News
Shared IDE For PCIe Bifurcation: Scaling Security Without Scaling Complexity & Resources
Allowing multiple controllers and links to utilize a common security infrastructure while maintaining independent protection mechanisms. The post Shared IDE For PCIe Bifurcation: Scaling Security Without Scaling Complexity & Resources appeared first on Semiconductor Engineering .
Aug 6, 2026Industry
Semiconductor Engineering / News
How To Scale AI Arithmetic Efficiently
Accelerating matrix multiplications in a variety of number formats while maintaining accuracy and reducing circuit area. The post How To Scale AI Arithmetic Efficiently appeared first on Semiconductor Engineering .
Aug 6, 2026Industry
Semiconductor Engineering / News
AI: Friend And Foe For Chip Security
AI has access to every known security paper and powerful tools, but what it does with that isn't clear. The post AI: Friend And Foe For Chip Security appeared first on Semiconductor Engineering .
Aug 6, 2026Industry
Semiconductor Engineering / News
When USB Reaches The Root Of Trust
The growing importance of peripheral interfaces in hardware threat models. The post When USB Reaches The Root Of Trust appeared first on Semiconductor Engineering .
Aug 6, 2026Memory
Semiconductor Engineering / News
Certified Automotive-Grade PUF IP: Unclonable Silicon Identity For Safety And Security
Combining SRAM-based identity generation with added functional safety and security mechanisms. The post Certified Automotive-Grade PUF IP: Unclonable Silicon Identity For Safety And Security appeared first on Semiconductor Engineering .
Aug 5, 2026Materials
Semiconductor Today Features / News
First continuous-wave UV VCSEL operation at room temperature
Researchers based in China claim the first gallium nitride (GaN)-based electrically injected continuous-lasing ultraviolet (UV) vertical-cavity surface-emitting laser (VCSEL), achieved by “careful design and processing”...
Aug 5, 2026Materials
Semiconductor Today News / News
Power Integrations demos first 2200V GaN technology for high-voltage power systems
Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) says that PowiGaN gallium nitride (GaN) technology is now rated at up to 2200V, far exceeding the voltage capabilities of all other commercially available GaN technologies, it is claimed....
Aug 5, 2026Materials
Semiconductor Today Features / News
Gate-all-around InGaN nano-LED
University of Michigan Ann Arbor in the USA reports a gate-all-around (GAA) nanoscale light-emitting diode (nano-LED), with a conformal gate electrode surrounding both the n-GaN contact region and the InGaN/GaN multiple-quantum-well (MQW) active region...
Aug 5, 2026Industry
Semiconductor Today News / News
Ascent Solar meets growing drone market demand
Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications – has emphasized its continued commitment to providing durable, reliable...
Aug 5, 2026Industry
Semiconductor Today News / News
Vector Photonics to demo PCSEL optical comms technology in Taiwan
Vector Photonics Ltd of the West of Scotland Science Park — which was spun off from the University of Glasgow in 2020, and is pioneering the use of photonic crystal surface-emitting lasers (PCSEL) in secure communications — is heading to Taiwan as part of Innovate UK’s...
Aug 5, 2026Materials
Semiconductor Today Features / News
UV LED reaches 19% wall-plug efficiency at 298nm
Researchers based in China report a room-temperature blue gallium nitride (GaN)-based photonic crystal surface-emitting laser (PCSEL) diode realized by regrowth-free fabrication...
Aug 5, 2026Industry
Semiconductor Today News / News
LITEON invests US$34m for 21% stake in DenseLight
Optoelectronic and power management firm LITEON Technology of Hsinchu, Taiwan has announced a strategic investment in DenseLight Photonics — an integrated device manufacturer (IDM) of indium phosphide (InP) optical communication components through its Singapore-based operating subsidiary — with a total transaction value of US$34.3m. LITEON will...
Aug 4, 2026Industry
Semiconductor Today Features / News
UV LED reaches 19% wall-plug efficiency at 298nm
University of California Santa Barbara in the USA claims the highest reported wall-plug efficiency (WPE) yet for ultraviolet light-emitting diodes (UV LEDs) around 298nm wavelength...
Aug 4, 2026Packaging
Semiconductor Today Features / News
E-mode gallium nitride quantum well in aluminium nitride XHEMTs
Cornell University and Soctera Inc in the USA have reported enhancement-mode (E-mode) single-crystal (Xtal) high-electron-mobility transistors (XHEMTs) based on a coherently-strained gallium nitride (GaN) quantum well (QW)-channel layer between an aluminium nitride (AlN) barrier and substrate...
Aug 4, 2026Industry
NVIDIA Newsroom / Company
NVIDIA Joins NSF State and Regional AI Hubs Program to Expand AI Research and Education Across the US
NVIDIA is participating in the U.S. National Science Foundation’s (NSF) State and Regional Artificial Intelligence Infrastructure Hubs program, an effort launching today to expand access to the advanced computing, data, software and expertise needed for AI-enabled research and education.
Aug 4, 2026AI Chips
NVIDIA Developer Blog / Company
Beyond VLAs: How World Action Models Reshape Robot Manipulation
A central challenge in robotics is building policies that generalize beyond the demonstrations they’re trained on. A policy that succeeds in a training scene...
Aug 4, 2026Industry
Semiconductor Today News / News
Silanna unifies operating companies Silanna UV and Silanna Semiconductor under single corporate identity
Silanna of Pinkenba, Brisbane, Australia has unified its operating companies Silanna UV – which provides far-UVC light sources for water quality sensors, gas sensors, disinfection, and HPLC (high-performance liquid chromatography) applications – and Silanna Semiconductor of San Diego, CA, USA – which makes analog-to-digital converters (ADCs)...
Aug 4, 2026Manufacturing
Semiconductor Today News / News
Aehr receives follow-on production order from lead silicon photonics customer
Aehr Test Systems of Fremont, CA, USA — which provides solutions for testing, burning-in and stabilizing semiconductor devices in wafer-level, singulated die, and packaged-part form — has received a follow-on production order from its lead silicon photonics wafer-level burn-in (WLBI) customer for a fully automated FOX-XP...
Aug 4, 2026Industry
NVIDIA Newsroom / Company
NVIDIA Alpamayo 2 Super, the Frontier Open Model for Robotaxis and Autonomous Vehicles, Now Available for Commercial Use
For robotaxis and other autonomous vehicles (AVs), the hardest problems aren’t the everyday scenarios. They’re the rare, complex situations that are difficult to anticipate and train for. Handling these long‑tail events takes more than just object detection and motion prediction. AVs must understand the situation, reason...
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