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Window: latest 15 collected items / 8 active sourcesMathematical Model Explains Bondwave Velocity and its Acceleration in Direct Wafer-Wafer Bonding (imec)
An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates.” Abstract: “Bonding and assembly processes have started to take the centre-stage in semiconductor manufacturing as they enable three-dimensional (3D) stacking and heterogeneous integration for novel interconnect architectures...
Surface Equilibration Mechanism Controls the Stability of a Model Co-deposited Glass Mixture of Organic Semiconductors
While previous work has identified the conditions for preparing ultrastable single-component organic glasses by physical vapor deposition (PVD), little is known about the stability of co-deposited mixtures. Here, we prepared binary PVD glasses of organic semiconductors, TPD (N,N-Bis(3-methylphenyl)-N,N-diphenylbenzidine) and m-MTDATA (4,4,4-Tris[phenyl(m-...
Overaging with stress in polymer glasses? Faster segmental dynamics despite larger yield stress!
It is well known that physical aging of polymer glasses increases their yield stress and affects their failure behavior. Studies indicate that application of moderate levels of stress during aging results in higher yield stress compared to aging in the absence of stress (quiescent aging). This...
Semiconductor Today News / News
Nokia acquires NXP’s fab in Chandler, Arizona, for conversion to InP optical comms
Finland-based telecom equipment maker Nokia Corp says that, as part of its long-term plans for optical component manufacturing capacity expansion, it has entered into a definitive agreement to acquire the Chandler Semiconductor Fabrication campus in Arizona of NXP Semiconductors N.V. of Eindhoven, The Netherlands. Opened in...
EE Times / News
U.S. Manufacturing Activity Hits Four-Year High in July
In July, U.S. manufacturing activity remained in expansion territory, growing at its fastest pace in more than four years. The post U.S. Manufacturing Activity Hits Four-Year High in July appeared first on EE Times .
Semiconductor Today News / News
Veeco receives LUMINA+ MOCVD system order for manufacturing InP lasers
Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that a global leader in optical and photonic technologies has selected its LUMINA+ metal-organic chemical vapor deposition (MOCVD) system to fabricate indium phosphide (InP) lasers for innovative communication solutions in the datacom...
EE Times / News
Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
Europe's next semiconductor champions will emerge from design expertise, customer knowledge, and IP—not manufacturing capacity alone. The post Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions appeared first on EE Times .
Semiconductor Today News / News
Aehr receives follow-on production order from lead silicon photonics customer
Aehr Test Systems of Fremont, CA, USA — which provides solutions for testing, burning-in and stabilizing semiconductor devices in wafer-level, singulated die, and packaged-part form — has received a follow-on production order from its lead silicon photonics wafer-level burn-in (WLBI) customer for a fully automated FOX-XP...
Synopsys News Releases / Company
Synopsys and Intel Foundry Fast-Track Customer Readiness from Silicon to Systems on Intel 14A
Short source-provided feed summary was not available.
NVIDIA Newsroom / Company
Industry Leaders Unite in Open Secure AI Alliance for AI Safety and Security
Open source software is a critical pillar of the global economy. It underpins cloud computing, financial services, manufacturing, telecommunications, government and internet services by making technology accessible and observable to communities of experts. Cybersecurity is among the top three beneficiaries of open source software. The Open...
NVIDIA Developer Blog / Company
Advancing Semiconductor Innovation Across Materials Engineering and Manufacturing
As AI workloads increase, explosive compute demand is pushing the semiconductor industry to meet unprecedented performance targets. Even small delays can have...
Applied Materials News Releases / Company
Applied Materials Unveils SENZ™, a Fully Integrated Visual System for Next-Gen Smart Glasses
SENZ will provide customers and partners with a co-optimized solution to bring high-performance augmented reality displays to market faster Groundbreaking technology will deliver world-class visual performance, seamless integration, and scalable manufacturing for next-generation smart glasses SANTA
Applied Materials News Releases / Company
Applied Materials Expands Singapore Manufacturing to Support AI Chip Demand
New state-of-the-art facility strengthens Applied’s global manufacturing and R&D capabilities to drive resilience and scalability Tampines Campus sets a new benchmark for sustainable, intelligent semiconductor equipment production SINGAPORE and SANTA CLARA, Calif., June 09, 2026 (GLOBE NEWSWIRE) --
Synopsys News Releases / Company
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Short source-provided feed summary was not available.
Applied Materials News Releases / Company
Applied Materials Partners with SCREEN To Bring Advanced Wafer Cleaning Technologies to EPIC Center
Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation chips Partnership deepens long-standing joint development relationship to overcome process challenges in leading-edge chipmaking SANTA CLARA, Calif., May 26, 2026
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