Memory
7 items / 5 sources
EE Times / Semiconductor Engineering / NVIDIA Newsroom / NVIDIA Developer BlogSEMICONDUCTOR BRIEFING
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Memory is the strongest current signal.
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Window: latest 7 collected items / 5 active sourcesNewsMemory
BIWIN and Tera Indústria de Semicondutores Sign Strategic Partnership Agreement
Shenzhen, China / Manaus, Brazil – August 6th, 2026: BIWIN Semiconductor (HK) Company Limited (“BIWIN”), a global provider of memory and storage packaging solutions, and TERA INDÚSTRIA DE SEMICONDUTORES S.A. (“Tera”), a Brazil-based semiconductor memory packaging company, announce the signing of a strategic partnership framework agreement...
NewsMemory
Chip Industry Week in Review
SK hynix's $38B new fabs; memory density increases; 2026 chip industry revenue to hit $1.65T; imec metrology roadmap; MIT's self-assembled contacts; new U.S. restrictions; Intel's new training program; NXP to buy Ambarella?; AI sandbox leaks; memory-centric accelerator; entangled photons; CHIPS Act spending under scrutiny. The post...
NewsMemory
Certified Automotive-Grade PUF IP: Unclonable Silicon Identity For Safety And Security
Combining SRAM-based identity generation with added functional safety and security mechanisms. The post Certified Automotive-Grade PUF IP: Unclonable Silicon Identity For Safety And Security appeared first on Semiconductor Engineering .
Aug 4, 2026Memory
NVIDIA Newsroom / Company
As AI Increases Demands on Memory, Storage Steps Up
Surging AI demands are driving the need for massive datasets and context windows that burst past the confines of system memory. But rising needs aren’t met by simply adding more storage capacity. What’s needed is useful, grounded insights from AI factories and efficient, secure storage architectures...
Aug 3, 2026Memory
NVIDIA Developer Blog / Company
NVIDIA Vera Storage Benchmarks: Faster Encryption, Compression, Integrity Checking, and Recovery for AI-Native Storage
Storage is an active part of every agentic AI workflow. As agents retrieve enterprise knowledge, access persistent memory, reuse key-value (KV) cache data,...
Jun 25, 2026Memory
Applied Materials News Releases / Company
Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New
Jun 15, 2026Memory
Applied Materials News Releases / Company
Applied Materials Unveils Deposition and Selective Etch Systems to Advance 3D Chip Scaling
New systems enable precision materials engineering in high-aspect-ratio 3D logic and memory chip structures Centris™ Spectral™ SiN ALD leverages innovative microwave plasma technology to deliver uniform silicon nitride deposition in challenging 3D structures Producer™ Selectra™ Mo Etch selectively
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