Packaging
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EE Times / Semiconductor Today Features / Synopsys News Releases / Applied Materials News ReleasesSEMICONDUCTOR BRIEFING
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Packaging is the strongest current signal.
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Window: latest 4 collected items / 4 active sourcesNewsPackaging
Chiplet Architectures as a Practical Path to Scalable Automotive Compute
Chiplets are auto’s escape hatch from bloated SoCs, scaling SDV compute without wrecking cost or software. The post Chiplet Architectures as a Practical Path to Scalable Automotive Compute appeared first on EE Times .
NewsPackaging
E-mode gallium nitride quantum well in aluminium nitride XHEMTs
Cornell University and Soctera Inc in the USA have reported enhancement-mode (E-mode) single-crystal (Xtal) high-electron-mobility transistors (XHEMTs) based on a coherently-strained gallium nitride (GaN) quantum well (QW)-channel layer between an aluminium nitride (AlN) barrier and substrate...
CompanyPackaging
Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
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May 20, 2026Packaging
Applied Materials News Releases / Company
Applied Materials Announces Broadcom as EPIC Innovation Partner
Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems Partnership will leverage Applied’s global network of innovation centers, including new EPIC Center in Silicon Valley SANTA CLARA, Calif., May 20, 2026 (GLOBE
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