RUN ONE QUESTION
Pick the process mechanism first.
For process education, the first job is not to expose a recipe. It is to keep geometry, saturation, method, limitation, and source notes attached to the claim.
Process / live-precomputedSputter deposition thickness uniformity
Replay radial film-thickness profiles to see why rotation, source shape, pressure regime, and geometry matter before a sputter recipe is trusted.
+/-3.97% / 7.7 nm / 100 nm / 2 radial profiles
Open simulation ->Process / live-precomputedThermal and e-beam evaporation line-of-sight
Compare long-throw and short-throw evaporation profiles, then separate open-field uniformity from sidewall shadowing.
2.1 nm / 100 nm / 11.1 nm / 100 nm / sidewall factor 0.18
Open simulation ->Process / live-precomputedALD growth-per-cycle saturation
Replay dose saturation, 100-cycle thickness arithmetic, temperature-window framing, and aspect-ratio conformality warnings.
0.11 nm/cycle / 11.0 nm / 2 s
Open simulation ->Process / live-precomputedSputter/PVD step coverage and continuity
Replay feature aspect ratio and scattering proxy to see why PVD coverage is not just blanket thickness.
62.057 / AR 0.5 / pressure proxy 10 / 15 cases
Open simulation ->