Ellipsometry thickness fit
Replay a thin-film thickness fit and inspect residuals so a plotted film thickness is not separated from its optical-model assumptions.
27.8 nm / 0.08 deg / +/-0.8 nm
Open simulation ->PROCESS REPLAY LAB / SA-PROC-003
Process metrology.
Check the measurement first.
This lab collects six precomputed metrology simulations for paper-first review: film thickness, sheet resistance, TLM, CD/overlay, SPC capability, and DOE response surfaces.
RUN ONE QUESTION
Pick the evidence gap first.
Every card keeps a measurement condition, extraction rule, source anchor, and limitation attached. The point is metrology discipline, not facility operation.
Four-point probe sheet resistance
Replay a wafer-level sheet-resistance map and compute nonuniformity before treating a process split as electrically stable.
50.4 ohm/sq / +/-3.97% / 25 points
Open simulation ->TLM contact resistance extraction
Fit resistance versus contact spacing to separate sheet resistance, contact resistance, and geometry assumptions.
Rc = 4 ohm/pad / 80 ohm/sq / 4.0e-6 ohm cm2
Open simulation ->CD-SEM and overlay control
Replay CD site statistics and overlay vectors so lithography evidence carries linewidth and registration together.
100.61 nm / 3 sigma = 1.97 nm / p95 = 3.08 nm
Open simulation ->SPC and process capability
Replay a CD sample set and compute Cp/Cpk so process spread, centering, and out-of-spec count stay distinct.
Cp = 1.44 / Cpk = 1.34 / 0 / 25
Open simulation ->DOE response surface
Replay a two-factor process grid so deposition rate, film stress, center points, and curvature warnings travel together.
64 nm/min / 56 nm/min / -110 MPa
Open simulation ->MODEL BOUNDARY
A metrology card is not a release system.
The public replay is for teaching, figures, and early paper planning. It is not a calibrated tool report, process recipe, wafer qualification, control dashboard, or signoff result.
Browse saved datasets
Open thickness fits, wafer maps, line fits, CD/overlay vectors, SPC samples, and DOE matrices with assumptions visible.
Download model cards
Use the public source notes and limitations when planning slides, drafts, figures, or classroom examples.
No recipe workflow
No process upload, tool account, facility credential, live execution, endpoint control, release dashboard, or qualified metrology claim is present.