Process / geometry
Thermal budget state
RTA, spike, and furnace artifacts expose normalized thermal states without an equipment program.
thermal-budget-stateCurated evidence path
Thermal budget to delay question
Follow normalized anneal budget through activation and diffusion proxies into device and FO4 sensitivity, then stop before Vmin or yield claims.
Review question
Which thermal, device, and circuit conditions must stay attached across the handoff?Permanent path link
- Nodes
- 5
- Bridge edges
- 3
- Stop edges
- 1
- Measured causal edges
- 0
Evidence classes
Read the label before the color.
- ProxyA proxy is not a physical prediction, calibration result, measurement, or causal proof.
- DerivedA derived result inherits every input and model assumption and is not measured evidence.
- ReproducedReproduction establishes the stated run result, not measured-silicon agreement or transfer to another context.
- MeasuredA measurement supports only its declared grain and conditions; it does not automatically prove cross-domain causality.
Ordered evidence chain
Follow each handoff. Stop at the stop.
Node order and edge fields are fixed by the V123 contract. No page interaction generates, ranks, or extends this chain.
- Proxy evidence
Evidence bridge
thermal budget to activation and diffusion
- Edge ID
- thermal-budget-to-activation
- From node
- thermal-budget-state
- To node
- thermal-activation-diffusion
- Unit or category
- normalized thermal-budget category
- Evidence class
- Proxy
- Status
- Bridge
- Assumption
- The Arrhenius-style axes and coefficients are educational and not material, dopant, or equipment calibration.
- Bridge condition
- Compare only the fixed modes and keep the no-recipe boundary attached.
- Limitation
- No temperature-time program, ramp, ambient, wafer thermal history, dopant profile, stress, or physical activation measurement is included.
- Measured replacement slot
- Owned temperature trace, implant/material context, sheet resistance, SIMS or spreading-resistance profile, uncertainty, and equipment genealogy.
- Deep link
- Open this exact edge
Material / interface
Activation / diffusion balance
The public replay separates activation benefit and diffusion burden as teaching proxies.
thermal-activation-diffusionProxy evidenceEvidence bridge
activation and diffusion to Rs or Vt
- Edge ID
- thermal-activation-to-device
- From node
- thermal-activation-diffusion
- To node
- thermal-device-metric
- Unit or category
- resistance / threshold category
- Evidence class
- Proxy
- Status
- Bridge
- Assumption
- The interactive chain uses original fixed coefficients rather than calibrated process-device simulation.
- Bridge condition
- Use only as a sensitivity map under the displayed chain states.
- Limitation
- No junction geometry, dopant species, interface state, mobility model, compact-model extraction, or measured device split closes the bridge.
- Measured replacement slot
- Matched thermal split with sheet resistance, junction profile, Id-Vg, capacitance, leakage, and uncertainty on registered structures.
- Deep link
- Open this exact edge
Source artifacts
Device metric
Rs / Vt sensitivity
The chain maps thermal-state proxies into sheet-resistance and threshold-related device questions.
thermal-device-metricProxy evidenceEvidence bridge
device metric to FO4 delay
- Edge ID
- thermal-device-to-delay
- From node
- thermal-device-metric
- To node
- thermal-delay-proxy
- Unit or category
- time / energy category
- Evidence class
- Proxy
- Status
- Bridge
- Assumption
- The chain and FO4 artifacts are bounded proxies with separate model assumptions and no timing-library correlation.
- Bridge condition
- Retain supply, load, temperature, model, and extraction boundaries when comparing states.
- Limitation
- No characterized cell library, extracted interconnect, PVT matrix, self-heating, aging, variation, or silicon ring-oscillator correlation is included.
- Measured replacement slot
- Calibrated compact model and characterized FO4 or ring-oscillator structures across PVT, load, extraction, variation, and uncertainty.
- Deep link
- Open this exact edge
Circuit behavior
FO4 delay sensitivity
The browser chain frames a bounded delay response and does not represent Liberty or silicon timing.
thermal-delay-proxyProxy evidenceEvidence stop
delay sensitivity to Vmin or yield
- Edge ID
- thermal-delay-to-yield-stop
- From node
- thermal-delay-proxy
- To node
- thermal-yield-stop
- Unit or category
- unsupported product category
- Evidence class
- Proxy
- Status
- Stop
- Assumption
- No V122 artifact provides direct measured genealogy from thermal split through timing to product outcome.
- Bridge condition
- Stop before process-window, Vmin, reliability, yield, disposition, or qualification statements.
- Limitation
- A deterministic delay proxy cannot establish manufactured distribution tails or causal attribution.
- Measured replacement slot
- Lot-wafer-die thermal genealogy, device/circuit measurements, array Vmin or timing, reliability, test coverage, yield labels, uncertainty, and owner review.
- Deep link
- Open this exact edge
Evidence stop
Stop before Vmin or yield
No public measured chain links anneal conditions to product timing, SRAM Vmin, reliability, or yield.
thermal-yield-stop
Path boundary
This path does not prove causality.
The navigator presents curated associations, assumptions, evidence classes, and replacement needs. It does not prove physical or statistical causality.
A stop is a product requirement, not missing UI. The page must not fill a stopped bridge with extrapolation, AI text, a recipe, an equipment setting, or an operating recommendation.
No public path authorizes process changes, equipment control, wafer disposition, qualification, signoff, product ranking, or production release.
Return to all causal chains